Site Map
- 2023 Chiplet Summit
- A Conversation About Reshoring Advanced Packaging in the U.S.
- A Promex Friendsgiving Event
- A Simplified QFN Package Characterization Technique
- Advances in Medical Device Design
- Advances in Medical Device Package Manufacturing
- BIOMEDevice Silicon Valley
- Developing new medical devices? Start with a free design review for reliability and manufacturability.
- Development Status of an OCCAM Electronic Assembly Method
- Die Attach Film Applications
- Enabling New Functionality in Medtech and Biotech Devices
- Endoscope Camera Assembly
- Even if all you’ve got for your new 5G product is a proof of concept, we can help accelerate the process
- Evolving Heterogeneous Integration Roadmap Highlights Trends
- Exploring the Intricacies of IC Packaging and Assembly Services
- Heterogeneous Assembly Datasheet
- Heterogeneous Chip Assembly Helps Optimize Medical and Wearable Devices
- Heterogeneous Integration Device Assembly: Key to Enabling Additional Innovations
- Heterogeneous Integration: Fertile Ground for Medical & Biotech Innovation
- Heterogenous assembly new? We’ve been doing it for 20 years!
- Heterogenous: It’s More Than Just Integration – It’s Assembly Too
- iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
- Industry Veteran Rosie Medina Appointed as VP of Sales and Marketing for Promex Industries, Inc. Divisions
- MD&M West
- MD&M West 2022
- MEMS & Sensors Technical Congress 2022
- New York Times: U.S. Focuses on Invigorating Chiplets to Stay Cutting Edge in Tech
- Promex Awarded CA FDB Medical Device Manufacturing License
- Promex Bolsters Leadership Team with David Fromm as Vice President of Engineering
- Promex CEO Richard Otte Presents at IEEE VLSI Test Symposium
- Promex CTO Annette Teng Receives EPS Regional Contributions Award for Outstanding Leadership, Impact on Programs and Growth
- Promex Expands Die Bonding Capacity, Adds New Capabilities
- Promex Explores Disruptive New Generation of Flexible Hybrid Electronics
- Promex Further Extends Die-Bonding Proficiencies
- Promex Industries Acquires Quik-Pak, a Division of Delphon
- Promex Industries to Showcase Heterogeneous Integration Expertise for Medical Devices at IMAPS Workshop for Advanced Packaging of Medical Microelectronics
- Promex Names David Fromm Chief Operating Officer
- Solving the Challenges of MEMS Device Assembly: Part One
- Solving the Challenges of MEMS Device Assembly: Part Two
- Tissue Marker Case Study
- Unique Assembly and Production Challenges
- Wafer Singulation
- Webinar: Heterogeneous Integration Manufacturing
Posts
Articles
- Advances in Medical Device Design
- Endoscope Camera Assembly
- Evolving Heterogeneous Integration Roadmap Highlights Trends
- Heterogeneous Assembly Datasheet
- Heterogeneous Chip Assembly Helps Optimize Medical and Wearable Devices
- Heterogeneous Integration: Fertile Ground for Medical & Biotech Innovation
- Solving the Challenges of MEMS Device Assembly: Part One
- Solving the Challenges of MEMS Device Assembly: Part Two
- Tissue Marker Case Study
- Unique Assembly and Production Challenges
- Wafer Singulation
Articles & Papers
- A Simplified QFN Package Characterization Technique
- Advances in Medical Device Design
- Advances in Medical Device Package Manufacturing
- Developing new medical devices? Start with a free design review for reliability and manufacturability.
- Development Status of an OCCAM Electronic Assembly Method
- Die Attach Film Applications
- Enabling New Functionality in Medtech and Biotech Devices
- Endoscope Camera Assembly
- Even if all you’ve got for your new 5G product is a proof of concept, we can help accelerate the process
- Evolving Heterogeneous Integration Roadmap Highlights Trends
- Heterogeneous Assembly Datasheet
- Heterogeneous Chip Assembly Helps Optimize Medical and Wearable Devices
- Heterogeneous Integration Device Assembly: Key to Enabling Additional Innovations
- Heterogeneous Integration: Fertile Ground for Medical & Biotech Innovation
- Heterogenous assembly new? We’ve been doing it for 20 years!
- Heterogenous: It’s More Than Just Integration – It’s Assembly Too
- Solving the Challenges of MEMS Device Assembly: Part One
- Solving the Challenges of MEMS Device Assembly: Part Two
- Tissue Marker Case Study
- Unique Assembly and Production Challenges
Events
- 2023 Chiplet Summit
- A Promex Friendsgiving Event
- BIOMEDevice Silicon Valley
- iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
- MD&M West
- MD&M West 2022
- MEMS & Sensors Technical Congress 2022
- Promex Awarded CA FDB Medical Device Manufacturing License
- Promex CEO Richard Otte Presents at IEEE VLSI Test Symposium
- Promex Explores Disruptive New Generation of Flexible Hybrid Electronics
Media Coverage
- A Conversation About Reshoring Advanced Packaging in the U.S.
- Enabling New Functionality in Medtech and Biotech Devices
- Exploring the Intricacies of IC Packaging and Assembly Services
- New York Times: U.S. Focuses on Invigorating Chiplets to Stay Cutting Edge in Tech
- Promex Bolsters Leadership Team with David Fromm as Vice President of Engineering
News
- Exploring the Intricacies of IC Packaging and Assembly Services
- Industry Veteran Rosie Medina Appointed as VP of Sales and Marketing for Promex Industries, Inc. Divisions
- New York Times: U.S. Focuses on Invigorating Chiplets to Stay Cutting Edge in Tech
- Promex Awarded CA FDB Medical Device Manufacturing License
- Promex Bolsters Leadership Team with David Fromm as Vice President of Engineering
- Promex CTO Annette Teng Receives EPS Regional Contributions Award for Outstanding Leadership, Impact on Programs and Growth
- Promex Expands Die Bonding Capacity, Adds New Capabilities
- Promex Further Extends Die-Bonding Proficiencies
- Promex Industries Acquires Quik-Pak, a Division of Delphon
- Promex Industries to Showcase Heterogeneous Integration Expertise for Medical Devices at IMAPS Workshop for Advanced Packaging of Medical Microelectronics
- Promex Names David Fromm Chief Operating Officer
Press Releases
- Exploring the Intricacies of IC Packaging and Assembly Services
- Industry Veteran Rosie Medina Appointed as VP of Sales and Marketing for Promex Industries, Inc. Divisions
- Promex Bolsters Leadership Team with David Fromm as Vice President of Engineering
- Promex CTO Annette Teng Receives EPS Regional Contributions Award for Outstanding Leadership, Impact on Programs and Growth
- Promex Expands Die Bonding Capacity, Adds New Capabilities
- Promex Further Extends Die-Bonding Proficiencies
- Promex Industries to Showcase Heterogeneous Integration Expertise for Medical Devices at IMAPS Workshop for Advanced Packaging of Medical Microelectronics
- Promex Names David Fromm Chief Operating Officer