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- 2023 Chiplet Summit
- 2025 Viewpoint: The Future of Flex Is Here
- 3.5D: The Great Compromise
- 3D Structures Challenge Wire Bond Inspection
- 6 steps for building an optimized QMS for medtech
- A Conversation About Reshoring Advanced Packaging in the U.S.
- A Promex Friendsgiving Event
- A Simplified QFN Package Characterization Technique
- ADLM 2024
- Advanced Packaging Drives Test And Metrology Innovations
- Advanced Packaging Driving New Collaboration Across Supply Chain
- Advanced Packaging Moving At Breakneck Pace
- Advances in Medical Device Design
- Advances in Medical Device Package Manufacturing
- Benefits And Challenges In Multi-Die Assemblies
- Benefits and Challenges of Sensors that Utilize Chips and MEMS
- Big Changes Ahead For Interposers And Substrates
- Big Changes Ahead In Power Delivery, Materials, And Interconnects
- Big Changes In Medical Electronics
- BIOMEDevice Silicon Valley
- Blog: Advancing Medical Devices through Heterogeneous Integration
- Blog: Setting the Standard in Microelectronics Die Preparation
- Blog: Using Glass as a Dielectric in Electronic Packaging
- Building Better Bridges In Advanced Packaging
- Bump Reliability is Challenged By Latent Defects
- Can Chiplets Serve Cost-Conscious Apps?
- Challenges Grow For Creating Smaller Bumps For Flip Chips
- Challenges Grow For Medical ICs
- Chiplet Summit 2025
- Choosing adhesives
- Co-Packaged Optics Reaches Power Efficiency Tipping Point
- Controlling Warpage In Advanced Packages
- Cooling Chips Still A Top Challenge
- Designing for Success: How Medical Device Teams Can Leverage Heterogeneous Integration
- Designing for Success: How Medical Device Teams Can Leverage Heterogeneous Integration
- Developing new medical devices? Start with a free design review for reliability and manufacturability.
- Development Status of an OCCAM Electronic Assembly Method
- Die Attach Film Applications
- ECTC 2025
- Electrifying Everything: Power Moves Toward ICs
- Emerging Technologies Driving Heterogeneous Integration
- Enabling New Functionality in Medtech and Biotech Devices
- Enabling New Functionality In Medtech And Biotech Devices
- Endoscope Camera Assembly
- Even if all you’ve got for your new 5G product is a proof of concept, we can help accelerate the process
- Evolving Heterogeneous Integration Roadmap Highlights Trends
- Exploring the Intricacies of IC Packaging and Assembly Services
- FOPLP Gains Traction in Advanced Semiconductor Packaging
- Getting a complex medical device across the finish line is easier when you pass through multiple gates
- Goals of Going Green
- Governments Begin To Shape Metrology Directions
- Heterogeneous Assembly Datasheet
- Heterogeneous Chip Assembly Helps Optimize Medical and Wearable Devices
- Heterogeneous Integration Device Assembly: Key to Enabling Additional Innovations
- Heterogeneous Integration Finding Its Footing
- Heterogeneous Integration: Fertile Ground for Medical & Biotech Innovation
- Heterogenous assembly new? We’ve been doing it for 20 years!
- Heterogenous integration packs big innovation into small medical devices
- Heterogenous: It’s More Than Just Integration – It’s Assembly Too
- How Die Dimensions Challenge Assembly Processes
- How Does Your Med Device Stack Up?
- How this device broke through the blood-brain barrier
- How to Build Better Medical Microelectronics
- iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
- iMAPS Advanced Packaging for Medical Microelectronics Workshop
- iMAPS CHIPcon 2025
- iMAPS DPC 2025
- iMAPS Symposium 2025
- Industry Veteran Rosie Medina Appointed as VP of Sales and Marketing for Promex Industries, Inc. Divisions
- Issues and Challenges with IC Packaging
- Key Considerations in Designing, Developing, and Manufacturing Implantable Devices
- Linear Pluggable Optics Save Energy In Data Centers
- Managing Thermal-Induced Stress In Chips
- MD&M West
- MD&M West 2022
- MD&M West 2025
- MEDevice 2024
- MEMS & Sensors Technical Congress 2022
- Mini-Consortia Forming Around Chiplets
- Navigating Heat In Advanced Packaging
- Navigating Increased Complexity In Advanced Packaging
- Navigating thermally induced dynamics when developing miniaturized medical devices
- New Approaches To Power Decoupling
- New York Times: U.S. Focuses on Invigorating Chiplets to Stay Cutting Edge in Tech
- NextFlex Innovation Days 2025
- Packaging With Fewer People And Better Results
- Powerful Sensors for the Eye
- Precision Patterning Options Emerge For Advanced Packaging
- Promex 2024 Open House
- Promex and Realeve Recognized by MedTech Breakthrough for Best New Pain Management Solution
- Promex Awarded CA FDB Medical Device Manufacturing License
- Promex Bolsters Leadership Team with David Fromm as Vice President of Engineering
- Promex Broadens Leadership Team Expertise, Naming Matt Hansen Director of Sales and Business Development
- Promex CEO Richard Otte Presents at IEEE VLSI Test Symposium
- Promex CTO Annette Teng Receives EPS Regional Contributions Award for Outstanding Leadership, Impact on Programs and Growth
- Promex Expands Assembly Line with UV Laser & SPI Systems
- Promex Expands Die Bonding Capacity, Adds New Capabilities
- Promex Explores Disruptive New Generation of Flexible Hybrid Electronics
- Promex Further Extends Die-Bonding Proficiencies
- Promex Industries Acquires Quik-Pak, a Division of Delphon
- Promex Industries and QP Technologies Appoint Jeannine Serbanich as Vice President of Finance
- Promex Industries and QP Technologies Implement Sales/Marketing Reorganization, Promoting Rosie Medina to Promex Senior Vice President and Matt Hansen to QP Technologies Vice President
- Promex Industries CEO Richard Otte Honored with IEEE Electronics Manufacturing Technology Award
- Promex Industries to Showcase Heterogeneous Integration Expertise for Medical Devices at IMAPS Workshop for Advanced Packaging of Medical Microelectronics
- Promex Names David Fromm Chief Operating Officer
- Right Sizing Implantable Pressure Sensors
- Sensor Packaging: Critical MEMS Considerations
- Sensors Converge 2025
- Silicon Photonics Manufacturing Ramps Up
- Solving the Challenges of MEMS Device Assembly: Part One
- Solving the Challenges of MEMS Device Assembly: Part Two
- The Engineer Behind 50 Years of Medtech Innovation
- The Miniaturization Revolution in Electronics
- The Path To Known Good Interconnects
- The Race To Glass Substrates
- The World’s Tiniest Computers, Medical Devices
- Tissue Marker Case Study
- U.S. Focuses on Invigorating ‘Chiplets’ to Stay Cutting-Edge in Tech
- Unique Assembly and Production Challenges
- Unknowns And Challenges In Advanced Packaging
- Wafer Singulation
- Webinar: Heterogeneous Integration Manufacturing
- What Exactly Are Chiplets And Heterogeneous Integration?
- What Works Best For Chiplets
- What’s Next In Advanced Packaging?
- White Paper: Advanced Packaging for Medical Microelectronics
- Why Small Fab And Assembly Houses Are Thriving
- Wine Down Friday with Promex’s Dick Otte
- Wirebonding Is Here To Stay
Posts
Articles
- Advances in Medical Device Design
- Blog: Advancing Medical Devices through Heterogeneous Integration
- Blog: Setting the Standard in Microelectronics Die Preparation
- Blog: Using Glass as a Dielectric in Electronic Packaging
- Endoscope Camera Assembly
- Evolving Heterogeneous Integration Roadmap Highlights Trends
- Heterogeneous Assembly Datasheet
- Heterogeneous Chip Assembly Helps Optimize Medical and Wearable Devices
- Heterogeneous Integration: Fertile Ground for Medical & Biotech Innovation
- Solving the Challenges of MEMS Device Assembly: Part One
- Solving the Challenges of MEMS Device Assembly: Part Two
- Tissue Marker Case Study
- Unique Assembly and Production Challenges
- Wafer Singulation
Articles & Papers
- A Simplified QFN Package Characterization Technique
- Advances in Medical Device Design
- Advances in Medical Device Package Manufacturing
- Developing new medical devices? Start with a free design review for reliability and manufacturability.
- Development Status of an OCCAM Electronic Assembly Method
- Die Attach Film Applications
- Enabling New Functionality in Medtech and Biotech Devices
- Endoscope Camera Assembly
- Even if all you’ve got for your new 5G product is a proof of concept, we can help accelerate the process
- Evolving Heterogeneous Integration Roadmap Highlights Trends
- Heterogeneous Assembly Datasheet
- Heterogeneous Chip Assembly Helps Optimize Medical and Wearable Devices
- Heterogeneous Integration Device Assembly: Key to Enabling Additional Innovations
- Heterogeneous Integration: Fertile Ground for Medical & Biotech Innovation
- Heterogenous assembly new? We’ve been doing it for 20 years!
- Heterogenous: It’s More Than Just Integration – It’s Assembly Too
- Solving the Challenges of MEMS Device Assembly: Part One
- Solving the Challenges of MEMS Device Assembly: Part Two
- Tissue Marker Case Study
- Unique Assembly and Production Challenges
- White Paper: Advanced Packaging for Medical Microelectronics
Events
- 2023 Chiplet Summit
- A Promex Friendsgiving Event
- ADLM 2024
- BIOMEDevice Silicon Valley
- Chiplet Summit 2025
- ECTC 2025
- iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
- iMAPS Advanced Packaging for Medical Microelectronics Workshop
- iMAPS CHIPcon 2025
- iMAPS DPC 2025
- iMAPS Symposium 2025
- MD&M West
- MD&M West 2022
- MD&M West 2025
- MEDevice 2024
- MEMS & Sensors Technical Congress 2022
- NextFlex Innovation Days 2025
- Promex 2024 Open House
- Promex Awarded CA FDB Medical Device Manufacturing License
- Promex CEO Richard Otte Presents at IEEE VLSI Test Symposium
- Promex Explores Disruptive New Generation of Flexible Hybrid Electronics
- Sensors Converge 2025
Media Coverage
- 2025 Viewpoint: The Future of Flex Is Here
- 3.5D: The Great Compromise
- 3D Structures Challenge Wire Bond Inspection
- 6 steps for building an optimized QMS for medtech
- A Conversation About Reshoring Advanced Packaging in the U.S.
- Advanced Packaging Drives Test And Metrology Innovations
- Advanced Packaging Driving New Collaboration Across Supply Chain
- Advanced Packaging Moving At Breakneck Pace
- Benefits And Challenges In Multi-Die Assemblies
- Benefits and Challenges of Sensors that Utilize Chips and MEMS
- Big Changes Ahead For Interposers And Substrates
- Big Changes Ahead In Power Delivery, Materials, And Interconnects
- Big Changes In Medical Electronics
- Building Better Bridges In Advanced Packaging
- Bump Reliability is Challenged By Latent Defects
- Can Chiplets Serve Cost-Conscious Apps?
- Challenges Grow For Creating Smaller Bumps For Flip Chips
- Challenges Grow For Medical ICs
- Choosing adhesives
- Co-Packaged Optics Reaches Power Efficiency Tipping Point
- Controlling Warpage In Advanced Packages
- Cooling Chips Still A Top Challenge
- Designing for Success: How Medical Device Teams Can Leverage Heterogeneous Integration
- Electrifying Everything: Power Moves Toward ICs
- Emerging Technologies Driving Heterogeneous Integration
- Enabling New Functionality in Medtech and Biotech Devices
- Enabling New Functionality In Medtech And Biotech Devices
- Exploring the Intricacies of IC Packaging and Assembly Services
- FOPLP Gains Traction in Advanced Semiconductor Packaging
- Getting a complex medical device across the finish line is easier when you pass through multiple gates
- Goals of Going Green
- Governments Begin To Shape Metrology Directions
- Heterogeneous Integration Finding Its Footing
- Heterogenous integration packs big innovation into small medical devices
- How Die Dimensions Challenge Assembly Processes
- How Does Your Med Device Stack Up?
- How this device broke through the blood-brain barrier
- How to Build Better Medical Microelectronics
- Issues and Challenges with IC Packaging
- Key Considerations in Designing, Developing, and Manufacturing Implantable Devices
- Linear Pluggable Optics Save Energy In Data Centers
- Managing Thermal-Induced Stress In Chips
- Mini-Consortia Forming Around Chiplets
- Navigating Heat In Advanced Packaging
- Navigating Increased Complexity In Advanced Packaging
- Navigating thermally induced dynamics when developing miniaturized medical devices
- New Approaches To Power Decoupling
- New York Times: U.S. Focuses on Invigorating Chiplets to Stay Cutting Edge in Tech
- Packaging With Fewer People And Better Results
- Powerful Sensors for the Eye
- Precision Patterning Options Emerge For Advanced Packaging
- Promex Bolsters Leadership Team with David Fromm as Vice President of Engineering
- Right Sizing Implantable Pressure Sensors
- Sensor Packaging: Critical MEMS Considerations
- Silicon Photonics Manufacturing Ramps Up
- The Engineer Behind 50 Years of Medtech Innovation
- The Miniaturization Revolution in Electronics
- The Path To Known Good Interconnects
- The Race To Glass Substrates
- The World’s Tiniest Computers, Medical Devices
- U.S. Focuses on Invigorating ‘Chiplets’ to Stay Cutting-Edge in Tech
- Unknowns And Challenges In Advanced Packaging
- What Exactly Are Chiplets And Heterogeneous Integration?
- What Works Best For Chiplets
- What’s Next In Advanced Packaging?
- Why Small Fab And Assembly Houses Are Thriving
- Wine Down Friday with Promex’s Dick Otte
- Wirebonding Is Here To Stay
News
- Exploring the Intricacies of IC Packaging and Assembly Services
- Industry Veteran Rosie Medina Appointed as VP of Sales and Marketing for Promex Industries, Inc. Divisions
- New York Times: U.S. Focuses on Invigorating Chiplets to Stay Cutting Edge in Tech
- Promex Awarded CA FDB Medical Device Manufacturing License
- Promex Bolsters Leadership Team with David Fromm as Vice President of Engineering
- Promex Broadens Leadership Team Expertise, Naming Matt Hansen Director of Sales and Business Development
- Promex CTO Annette Teng Receives EPS Regional Contributions Award for Outstanding Leadership, Impact on Programs and Growth
- Promex Expands Die Bonding Capacity, Adds New Capabilities
- Promex Further Extends Die-Bonding Proficiencies
- Promex Industries Acquires Quik-Pak, a Division of Delphon
- Promex Industries and QP Technologies Appoint Jeannine Serbanich as Vice President of Finance
- Promex Industries and QP Technologies Implement Sales/Marketing Reorganization, Promoting Rosie Medina to Promex Senior Vice President and Matt Hansen to QP Technologies Vice President
- Promex Industries to Showcase Heterogeneous Integration Expertise for Medical Devices at IMAPS Workshop for Advanced Packaging of Medical Microelectronics
- Promex Names David Fromm Chief Operating Officer
Press Releases
- Exploring the Intricacies of IC Packaging and Assembly Services
- Industry Veteran Rosie Medina Appointed as VP of Sales and Marketing for Promex Industries, Inc. Divisions
- Promex and Realeve Recognized by MedTech Breakthrough for Best New Pain Management Solution
- Promex Bolsters Leadership Team with David Fromm as Vice President of Engineering
- Promex Broadens Leadership Team Expertise, Naming Matt Hansen Director of Sales and Business Development
- Promex CTO Annette Teng Receives EPS Regional Contributions Award for Outstanding Leadership, Impact on Programs and Growth
- Promex Expands Assembly Line with UV Laser & SPI Systems
- Promex Expands Die Bonding Capacity, Adds New Capabilities
- Promex Further Extends Die-Bonding Proficiencies
- Promex Industries and QP Technologies Appoint Jeannine Serbanich as Vice President of Finance
- Promex Industries and QP Technologies Implement Sales/Marketing Reorganization, Promoting Rosie Medina to Promex Senior Vice President and Matt Hansen to QP Technologies Vice President
- Promex Industries CEO Richard Otte Honored with IEEE Electronics Manufacturing Technology Award
- Promex Industries to Showcase Heterogeneous Integration Expertise for Medical Devices at IMAPS Workshop for Advanced Packaging of Medical Microelectronics
- Promex Names David Fromm Chief Operating Officer