Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is accelerating, making it harder for the entire ecosystem to keep up with those changes. Metrology is adapting to meet these varied demands, integrating techniques tailored to the complex structures of each packaging type. Technologies such as X-ray fluorescence (XRF), atomic force microscopy (AFM), ellipsometry, and white-light interferometry provide engineers with unprecedented precision and capabilities, but they also have their limitations. In this Semiconductor Engineering article, Promex CEO Dick Otte shares his perspective on overcoming these challenges.