Articles & White Papers
Articles & White Papers
We’re leaders in the industry of miniaturization – learn more from our experts on topics around cGMP manufacturing, FDA compliance, medical/biotech devices, and much more.
Featured Article
Advances in Medical Device Package Manufacturing
“Advances in Medical Device Package Manufacturing” by Former Promex Chief Technology Officer Dr. Edward S. Binkley. Presented at the MEPTEC Packaging Symposium, October 2014.Here's a downloadable version (.pdf) of the paper:[pdf-embedder...
Browse Articles & White Papers
Heterogeneous Chip Assembly Helps Optimize Medical and Wearable Devices
Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the processes associated with assembling these classes of devices.
Heterogeneous Integration: Fertile Ground for Medical & Biotech Innovation
Heterogenous integration is the newest frontier for the medical and biotech manufacturing services industry to contribute our own innovations by developing the processes to build these unique combinations of electronic, sensing, communication, and “effecting” devices.
Solving the Challenges of MEMS Device Assembly: Part Two
Once you have your MEMS device evaluated, your package chosen and your assembly process flow developed, it’s time to optimize your MEMS project flow. Optimizing your MEMS project flow is essential to achieving reduced costs with high yields. We’ll explore this aspect in part two, examining issues that typically impact a project and key considerations to help stave them off.
Solving the Challenges of MEMS Device Assembly: Part One
Microelectromechanical systems (MEMS) devices have become part of everyday life, as they are being incorporated into an increasingly wide range of applications, from smartphones to industrial instrumentation to medical devices to vehicles.
Heterogeneous Assembly Datasheet
Medical and biotech devices often include optical, chemical, RF, and liquid elements. Some are combined with electronic devices to increase functionality or interaction with the environment. To produce these devices, multiple technologies are combined in a...
Tissue Marker Case Study
A short video looking at the fabrication issues for a small radio-frequency tissue marker used in oncology surgeries. Promex specializes in the assembly and fabrication of complex medical devices and biotech instruments and consumables involving customized assembly...
Endoscope Camera Assembly
A short video of how advances in semiconductor assembly and fabrication are re-shaping medical device design. Advances in semiconductor assembly and fabrication are offering medical device designers new options for smaller, more compact, and more sophisticated...
Wafer Singulation
A short video looking at how blade dicing remains the optimal solution for wafer singulation in most cases. Singulation is the process of dicing a silicon wafer into individual units and is a critical step in assembly and packaging. Dicing technology has continued...
Unique Assembly and Production Challenges
Here are some of unique assembly and production challenges we can solve: The smaller the better. We worked with the customer to design an optical Class 3 device that would be inserted into the human body. Requirements included Class 100 assembly and strict...
Advances in Medical Device Design
A short video of how advances in semiconductor assembly and fabrication are re-shaping medical device design:Advances in semiconductor assembly and fabrication are offering medical device designers new options for smaller, more compact, and more sophisticated...
Evolving Heterogeneous Integration Roadmap Highlights Trends
by: Annette Teng, CTO, Promex/Quik-Pak As noted in last month’s blog post, the semiconductor industry has turned its efforts toward the ongoing fleshing out of a roadmap focused on advancing heterogeneous integration (HI). HI integrates separately manufactured...
Die Attach Film Applications
"Die Attach Film Applications" By Promex CTO Annette TengPublished in MEPTEC Report Winter 2016 Die attach film (DAF) and dicing die attach film (DDAF) have been commercially available since 2000. Epoxy paste adhesives have historically been the sole epoxy material...
Heterogeneous Chip Assembly Helps Optimize Medical and Wearable Devices
Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the processes associated with assembling these classes of devices.
Heterogeneous Integration: Fertile Ground for Medical & Biotech Innovation
Heterogenous integration is the newest frontier for the medical and biotech manufacturing services industry to contribute our own innovations by developing the processes to build these unique combinations of electronic, sensing, communication, and “effecting” devices.
Solving the Challenges of MEMS Device Assembly: Part Two
Once you have your MEMS device evaluated, your package chosen and your assembly process flow developed, it’s time to optimize your MEMS project flow. Optimizing your MEMS project flow is essential to achieving reduced costs with high yields. We’ll explore this aspect in part two, examining issues that typically impact a project and key considerations to help stave them off.
Solving the Challenges of MEMS Device Assembly: Part One
Microelectromechanical systems (MEMS) devices have become part of everyday life, as they are being incorporated into an increasingly wide range of applications, from smartphones to industrial instrumentation to medical devices to vehicles.
Heterogeneous Assembly Datasheet
Medical and biotech devices often include optical, chemical, RF, and liquid elements. Some are combined with electronic devices to increase functionality or interaction with the environment. To produce these devices, multiple technologies are combined in a...
Tissue Marker Case Study
A short video looking at the fabrication issues for a small radio-frequency tissue marker used in oncology surgeries. Promex specializes in the assembly and fabrication of complex medical devices and biotech instruments and consumables involving customized assembly...
Endoscope Camera Assembly
A short video of how advances in semiconductor assembly and fabrication are re-shaping medical device design. Advances in semiconductor assembly and fabrication are offering medical device designers new options for smaller, more compact, and more sophisticated...
Wafer Singulation
A short video looking at how blade dicing remains the optimal solution for wafer singulation in most cases. Singulation is the process of dicing a silicon wafer into individual units and is a critical step in assembly and packaging. Dicing technology has continued...
Unique Assembly and Production Challenges
Here are some of unique assembly and production challenges we can solve: The smaller the better. We worked with the customer to design an optical Class 3 device that would be inserted into the human body. Requirements included Class 100 assembly and strict...
Advances in Medical Device Design
A short video of how advances in semiconductor assembly and fabrication are re-shaping medical device design:Advances in semiconductor assembly and fabrication are offering medical device designers new options for smaller, more compact, and more sophisticated...
Evolving Heterogeneous Integration Roadmap Highlights Trends
by: Annette Teng, CTO, Promex/Quik-Pak As noted in last month’s blog post, the semiconductor industry has turned its efforts toward the ongoing fleshing out of a roadmap focused on advancing heterogeneous integration (HI). HI integrates separately manufactured...
Die Attach Film Applications
"Die Attach Film Applications" By Promex CTO Annette TengPublished in MEPTEC Report Winter 2016 Die attach film (DAF) and dicing die attach film (DDAF) have been commercially available since 2000. Epoxy paste adhesives have historically been the sole epoxy material...