Co-Packaged Optics Reaches Power Efficiency Tipping Point

Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at terabits per second speeds, but manufacturing challenges remain regarding fiber-to-photonic IC alignment, thermal mitigation, and optical testing strategies. Our CEO Dick Otte discusses thermal mitigation and fiber alignment challenges in this Semiconductor Engineering article.

Read the full article here.