Component Assembly for Medical & Biotech Devices
Promex specializes in custom assembly processes for Medical & Biotech Devices. Physically small component assemblies that incorporate unique functionality as well as microelectronics requiring complex fabrication processes.
A fully integrated cGMP manufacturer of FDA-compliant Class II/III medical device & biotech assemblies located in the heart of Silicon Valley:
specializations
Medical Devices
A fully integrated cGMP manufacturer of FDA compliant Class II/III assemblies for medical & surgical devices, implantables & wearables.
Promex is ISO 13485 & ISO 9001 certified & California FDB registered for Medical Device Manufacturing.
Biotech Instruments
Optical chains for PCR platforms, NGS flow cell fabrication, qPCR consumable modules, microfluidics modules, genomic assemblies.
Promex can do prototype to high-volume assemblies requiring Class 1000 or Class 100 cleanroom fabrication.
Clinical Diagnostics
FDA compliant cGMP fabrication of complex components for diagnostics devices.
Such as stereoscopic endoscope camera assemblies, ultrasound imaging sensors, 1200-µm RF tissue markers, and PCR cartridges for molecular diagnostics.
Turning Concepts into Products
Prototype to Production
Single-source complex microelectronic component assembly. Your process developed with our Master Validation Plan in phases from concept to production. Not just for short prototype runs but processes ready to scale to large-volume production.
Your engineering team can work with us to ensure your conceptual design will work and your component assembly can be efficiently manufactured. We provide expertise in how to design for assembly.
Prototypes
Compliance
A fully integrated cGMP manufacturer of FDA-compliant Class II/III medical device assemblies. ISO 13485 certified. We understand the unique demands of FDA compliance and full manufacturing process validation.
Production
Our Services
Fully-Integrated Microelectronic Assembly
Frustrated with having to coordinate between separate facilities for different process steps? Promex has all major component assembly & packaging processes under a single roof.
From SMT through to wafer prep, die-attach, wire bonding, flip-chip through to encapsulation & singulation. All in a single fully-integrated ISO 13485 certified cGMP facility located in the heart of Silicon Valley. Including processes requiring Class-100 and Class-1000 cleanrooms.
Surface Mount Technology
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- 2 full SMT lines
- 00804 capable
- Stencil Printing
- 12 Zone Reflow Oven
- Vacuum Reflow
- Ball Attach
- Low-Temp Solders
Wafer Prep
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- Wafer Backgrinding
- Wafer Dicing
- Up to 300 mm
- Die Attach Film (DAF) Expertise
- Multi-project Wafers
Die Attach
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- High Accuracy Automation
- Datacon APM EVO & EVO+
- Interposer/MEMs/PZT
- Die Attach Film (DAF)
- Stacked Die
- Precision Epoxy Dispensing
- Die Shear/Stud Pull
Flip Chip
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- Thermal Compression (TCB)
- Cu Pillar
- Lead Free/Leaded Solder
- High Bump Count >10k
- Underfill
- Fluxless Underfill
- Heatsink Attach
Wire Bond
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- Gold Ball
- Aluminum Wedge
- Ribbon
- Multi-Tier/Stacked Die
- Wirepull Monitoring
Encapsulation
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- Dam & Fill
- Air Cavity / Lid
- Over Mold
- Automated Dispense
- Microfluidic Options
- Class-100 Cleanroom
Singulation
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- Up to 12″ Wafers
- Thick Packages >5mm
- Ceramics
- Glass
- Piezoelectrics (PZT)
- Microfluidic & Build-Up Wafers
- Organic Substrates
Other Capabilities
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- Thick Film Printing
- Ceramic Packages
- Confocal Scanning Acoustic Microscopy (CSAM)
- High-Resolution X-Ray
- Keyence Surface Topography
- 3-D Printing
Single-Site Production
US-Based Operations
Your products are fabricated in a US-based fully integrated facility located in the heart of Silicon Valley. All your process steps under one roof with a single production team.
IP Security
IP Security risks are reduced as well as the geopolitical impacts on the supply chain. At Promex, our priority is to protect our customers’ IP.
Time Zone
Major time-zone differences makes coordination with production teams difficult. Proximity means immediate & responsive communications.
Offshore Overhead
Increased transit time and shipping expenses and delays in clearing Customs slows production and increases inventory demands.
Typical Clients
QP Technologies (formerly Quik-Pak) offers microelectronic packaging and assembly services, wafer preparation, and substrate design and development services targeting a range of end markets, including commercial, RF, power, industrial, automotive, medical, and mil-aero.
Getting Started
Concept to Commercialization
Whether you need short-run proof-of-concept prototypes, high-volume production, or a second-source manufacturer, Promex can help. Reach out to us and let's have a no-pressure conversation about how we might help advance your project to success.
