Bringing your ideas to life
Advanced, packaging and assembly for key subsystems used in a wide range of applications.
We specialize in physically small device assemblies that incorporate microelectronics and components with unique functionality requiring complex manufacturing processes. Our Silicon Valley-based Class 100/Class 1000 cleanrooms are ISO 13485:2016 and ISO 9001:2015 certified and utilize IPC certified technicians. We are ITAR registered and hold a CA FDB license.
specializations
Heterogeneous
Integration
Our proficiency in the heterogeneous integration of tiny components with unique functionality using customized advanced packaging and assembly processes helps you meet your product development goals—from concept to commercialization.
We combine electronic and nonelectronic components to bring your unique products to life and ensure a sustainable and robust path to market.
Advanced
Packaging
Advanced packaging and assembly is the core of our service offerings.
We provide the full range of packaging and assembly services, from SMT, wafer prep, and die bonding, to wirebonding, encapsulation & finishing, as well as test & documentation.
Medical
Devices
We are a fully integrated cGMP manufacturer of FDA compliant Class II/III medical device & biotech assemblies located in the heart of Silicon Valley.
We offer complex assembly unique to specialized requirements of medical device and biotech clients.
Turning Concepts into Products
Prototype to Production
Through collaborative learning with you, we design innovative manufacturing process flows that integrate electrical and nonelectrical components into unique assemblies.
Our Phase Gate process will take you from concept to production so you can leverage our expertise in how to design for assembly. We work with your engineering team to ensure your conceptual design is manufacturable and your component assembly can be efficiently achieved.
Prototypes
Compliance
A fully integrated cGMP manufacturer of FDA-compliant Class II/III medical device assemblies. ISO 13485 certified. We understand the unique demands of FDA compliance and full manufacturing process validation.
Production
Our Services
Fully-Integrated Microelectronic Assembly
Frustrated with having to coordinate between separate facilities for different process steps? Promex has all major component assembly & packaging processes under a single roof.
From SMT through to wafer prep, die-attach, wire bonding, flip-chip through to encapsulation & singulation. All in a single fully-integrated ISO 13485 certified cGMP facility located in the heart of Silicon Valley. Including processes requiring Class-100 and Class-1000 cleanrooms.
Single-Site Production
US-Based Operations
Your products are fabricated in a US-based fully integrated facility located in the heart of Silicon Valley. All your process steps under one roof with a single production team.
IP Security
IP Security risks are reduced as well as the geopolitical impacts on the supply chain. At Promex, our priority is to protect our customers’ IP.
Time Zone
Major time-zone differences makes coordination with production teams difficult. Proximity means immediate & responsive communications.
Onshore Benefits
Working with an onshore services provider reduces transit time, shipping costs, and customs delays. Let us accelerate your production and reduce inventory demands.
News & Events
Heterogeneous Integration: Fertile Ground for Medical & Biotech Innovation
Heterogenous integration is the newest frontier for the medical and biotech manufacturing services industry to contribute our own innovations by developing the processes to build these unique combinations of electronic, sensing, communication, and “effecting” devices.
Solving the Challenges of MEMS Device Assembly: Part Two
Once you have your MEMS device evaluated, your package chosen and your assembly process flow developed, it’s time to optimize your MEMS project flow. Optimizing your MEMS project flow is essential to achieving reduced costs with high yields. We’ll explore this aspect in part two, examining issues that typically impact a project and key considerations to help stave them off.
Typical Clients
QP Technologies (formerly Quik-Pak) offers microelectronic packaging and assembly services, wafer preparation, and substrate design and development services targeting a range of end markets, including commercial, RF, power, industrial, automotive, medical, and mil-aero.
Getting Started
Concept to Commercialization
Whether you need short-run proof-of-concept prototypes, high-volume production, or a second-source manufacturer, Promex can help. Reach out to us and let's have a no-pressure conversation about how we might help advance your project to success.
