All Resources
All Resources
Articles, News & Press Releases from Promex.
A fully integrated cGMP manufacturer of FDA compliant Class II / III medical device and biotech assemblies located in the heart of Silicon Valley.
Featured Article
Exploring the Intricacies of IC Packaging and Assembly Services
Dick Otte, CEO, and Rosie Medina, Vice President, Sales and Marketing, both at QP Technologies, discuss how the company helps its customers with a range of semiconductor technology solutions, covering wafer preparation, advanced assembly and design, IC packaging...
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Promex Names David Fromm Chief Operating Officer
SANTA CLARA, Calif. (August 10, 2023) -- Promex, a leader in the assembly of physically small devices that contain semiconductor chips for the medical, biotechnology and communications markets, announced it has named David Fromm its chief operating officer. The...
New York Times: U.S. Focuses on Invigorating Chiplets to Stay Cutting Edge in Tech
For more than 50 years, designers of computer chips mainly used one tactic to boost performance: They shrank electronic components to pack more power onto each piece of silicon. Then more than a decade ago, engineers at the chip maker Advanced Micro Devices began...
Enabling New Functionality in Medtech and Biotech Devices
By Dick Otte, CEO, Promex Industries Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these...
Promex Bolsters Leadership Team with David Fromm as Vice President of Engineering
Fromm's addition greatly enhances microelectronic component assembly capabilities for medtech and biotech markets. SANTA CLARA, Calif., April 19, 2023 – Promex Industries, a Silicon Valley-based provider of advanced microelectronic component assembly and design...
Promex Further Extends Die-Bonding Proficiencies
Finetech FINEPLACER® Sigma Bonder Targets Range of Application-Specific Projects State-of-the-art Finetech FINEPLACER® sigma advanced sub-micron bonder installed at Santa Clara facility SANTA CLARA, Calif., Feb. 02, 2023 (GLOBE NEWSWIRE) -- Promex Industries, a...
2023 Chiplet Summit
Promex will be exhibiting with Palo Alto Electron at the 2023 Chiplet Summit in San Jose, CA from January 24-26.
iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
Promex is looking forward to sponsoring the iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics.
Webinar: Heterogeneous Integration Manufacturing
Promex Enables New Functionality in MedTech Devices Combining technologies and components with electronics requires improved design methods, software, more material properties, longer supply chains and a sophisticated manufacturing process known as heterogeneous...
BIOMEDevice Silicon Valley
Promex President & CEO Dick Otte will be participating in the “Biomed Device Manufacturing Panel” discussion at BIOMEDevice 2022 on Tuesday, November 29th from 12:15 - 1 p.m. at Center Stage. Additionally, Promex will be exhibiting at booth 11533 during the...
A Promex Friendsgiving Event
RSVP Here In town for the BIOMEDevice Silicon Valley Conference? Stop by Promex Industries for our Friendsgiving Event. Join us for a tour of our facility while experiencing drinks and savory tapas. We will also be holding a series of raffles that include fabulous...
Promex Expands Die Bonding Capacity, Adds New Capabilities
State-of-the-art Besi 2200 evo plus die bonder installed at Santa Clara facility SANTA CLARA, Calif., Oct. 4, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has...
Heterogeneous Chip Assembly Helps Optimize Medical and Wearable Devices
Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the processes associated with assembling these classes of devices.
Heterogeneous Integration Device Assembly: Key to Enabling Additional Innovations
In Part 1 of this series, we explored the history of medical innovations and how new approaches, like heterogeneous integration (HI), are poised to enable groundbreaking new treatments. Here, we will expand on the role of HI, as well as the assembly challenges for these devices and the importance of working with the right partner to successfully bring new medical devices to market.
Heterogeneous Integration: Fertile Ground for Medical & Biotech Innovation
Heterogenous integration is the newest frontier for the medical and biotech manufacturing services industry to contribute our own innovations by developing the processes to build these unique combinations of electronic, sensing, communication, and “effecting” devices.
Solving the Challenges of MEMS Device Assembly: Part Two
Once you have your MEMS device evaluated, your package chosen and your assembly process flow developed, it’s time to optimize your MEMS project flow. Optimizing your MEMS project flow is essential to achieving reduced costs with high yields. We’ll explore this aspect in part two, examining issues that typically impact a project and key considerations to help stave them off.
Solving the Challenges of MEMS Device Assembly: Part One
Microelectromechanical systems (MEMS) devices have become part of everyday life, as they are being incorporated into an increasingly wide range of applications, from smartphones to industrial instrumentation to medical devices to vehicles.
MEMS & Sensors Technical Congress 2022
Promex President & CEO Dick Otte will present on "Assembly Issues That Are Unique to MEMS Devices," at the 2022 MEMS & Sensors Technical Congress as part of Session 6—Packaging Process Showdown , April 27 at 1:15pm. Learn more About the MEMS & Sensors...
MD&M West 2022
Please join us at MD&M West! APRIL 12-14, 2022 Booth 2063 Anaheim Convention Center Book Time with Me Check out the...
A Conversation About Reshoring Advanced Packaging in the U.S.
A 55-minute audio discussion with the CEO of Promex, Dick OtteThe acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors...
Promex Names David Fromm Chief Operating Officer
SANTA CLARA, Calif. (August 10, 2023) -- Promex, a leader in the assembly of physically small devices that contain semiconductor chips for the medical, biotechnology and communications markets, announced it has named David Fromm its chief operating officer. The...
New York Times: U.S. Focuses on Invigorating Chiplets to Stay Cutting Edge in Tech
For more than 50 years, designers of computer chips mainly used one tactic to boost performance: They shrank electronic components to pack more power onto each piece of silicon. Then more than a decade ago, engineers at the chip maker Advanced Micro Devices began...
Enabling New Functionality in Medtech and Biotech Devices
By Dick Otte, CEO, Promex Industries Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these...
Promex Bolsters Leadership Team with David Fromm as Vice President of Engineering
Fromm's addition greatly enhances microelectronic component assembly capabilities for medtech and biotech markets. SANTA CLARA, Calif., April 19, 2023 – Promex Industries, a Silicon Valley-based provider of advanced microelectronic component assembly and design...
Promex Further Extends Die-Bonding Proficiencies
Finetech FINEPLACER® Sigma Bonder Targets Range of Application-Specific Projects State-of-the-art Finetech FINEPLACER® sigma advanced sub-micron bonder installed at Santa Clara facility SANTA CLARA, Calif., Feb. 02, 2023 (GLOBE NEWSWIRE) -- Promex Industries, a...
2023 Chiplet Summit
Promex will be exhibiting with Palo Alto Electron at the 2023 Chiplet Summit in San Jose, CA from January 24-26.
iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
Promex is looking forward to sponsoring the iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics.
Webinar: Heterogeneous Integration Manufacturing
Promex Enables New Functionality in MedTech Devices Combining technologies and components with electronics requires improved design methods, software, more material properties, longer supply chains and a sophisticated manufacturing process known as heterogeneous...
BIOMEDevice Silicon Valley
Promex President & CEO Dick Otte will be participating in the “Biomed Device Manufacturing Panel” discussion at BIOMEDevice 2022 on Tuesday, November 29th from 12:15 - 1 p.m. at Center Stage. Additionally, Promex will be exhibiting at booth 11533 during the...
A Promex Friendsgiving Event
RSVP Here In town for the BIOMEDevice Silicon Valley Conference? Stop by Promex Industries for our Friendsgiving Event. Join us for a tour of our facility while experiencing drinks and savory tapas. We will also be holding a series of raffles that include fabulous...
Promex Expands Die Bonding Capacity, Adds New Capabilities
State-of-the-art Besi 2200 evo plus die bonder installed at Santa Clara facility SANTA CLARA, Calif., Oct. 4, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has...
Heterogeneous Chip Assembly Helps Optimize Medical and Wearable Devices
Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the processes associated with assembling these classes of devices.
Heterogeneous Integration Device Assembly: Key to Enabling Additional Innovations
In Part 1 of this series, we explored the history of medical innovations and how new approaches, like heterogeneous integration (HI), are poised to enable groundbreaking new treatments. Here, we will expand on the role of HI, as well as the assembly challenges for these devices and the importance of working with the right partner to successfully bring new medical devices to market.
Heterogeneous Integration: Fertile Ground for Medical & Biotech Innovation
Heterogenous integration is the newest frontier for the medical and biotech manufacturing services industry to contribute our own innovations by developing the processes to build these unique combinations of electronic, sensing, communication, and “effecting” devices.
Solving the Challenges of MEMS Device Assembly: Part Two
Once you have your MEMS device evaluated, your package chosen and your assembly process flow developed, it’s time to optimize your MEMS project flow. Optimizing your MEMS project flow is essential to achieving reduced costs with high yields. We’ll explore this aspect in part two, examining issues that typically impact a project and key considerations to help stave them off.
Solving the Challenges of MEMS Device Assembly: Part One
Microelectromechanical systems (MEMS) devices have become part of everyday life, as they are being incorporated into an increasingly wide range of applications, from smartphones to industrial instrumentation to medical devices to vehicles.
MEMS & Sensors Technical Congress 2022
Promex President & CEO Dick Otte will present on "Assembly Issues That Are Unique to MEMS Devices," at the 2022 MEMS & Sensors Technical Congress as part of Session 6—Packaging Process Showdown , April 27 at 1:15pm. Learn more About the MEMS & Sensors...
MD&M West 2022
Please join us at MD&M West! APRIL 12-14, 2022 Booth 2063 Anaheim Convention Center Book Time with Me Check out the...
A Conversation About Reshoring Advanced Packaging in the U.S.
A 55-minute audio discussion with the CEO of Promex, Dick OtteThe acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors...