Fan-Out Panel-Level Packaging (FOPLP) for advanced nodes, once hindered by manufacturability and yield challenges, is emerging as a promising solution to meet the industry’s demands for higher integration densities and cost efficiency. However, the technology still faces challenges in material compatibility, yield improvement, and lack of standardization, all of which must be addressed for broader adoption. In this Semiconductor Engineering article, Promex CEO Dick Otte shares his perspective on overcoming these challenges.