Santa Clara, Calif. – PR NEWSWIRE May 30, 2018 — Promex, a provider of innovative IC packaging and heterogeneous assembly solutions for medical, biotech, and sensor-based microelectronic devices, announces that Promex Chief Technology Officer Annette Teng has been selected to receive the 2018 Electronics Packaging Society Regional Contributions Award for Regions 1-6, 7 and 9.
According to EPS President Avi Bar-Cohen and EPS Awards Program Chair Eric Perfecto, this peer-nominated award recognizes significant and outstanding leadership and contributions to the growth and impact of EPS programs and activities at the regional level. The award will be announced during the EPS Luncheon at ECTC on Thursday, May 31 at the Sheraton San Diego Hotel & Marina, San Diego, CA.
“Rarely do individuals make as many different, yet significant, contributions to the IEEE Packaging Society as has Dr. Teng. She’s served as chapter officer, organized of chapter meetings, initiated new chapter relationships, established a student chapter at San Jose State University, and contributed to the revitalization of EPS’ IEMT Conference by presenting papers on packaging. Dr. Teng does all of this in addition to creatively contributing to Promex customers worldwide as our chief technology officer,” said Promex President and CEO Richard Otte.
Dr. Teng has served on IEEE-CPMT Santa Clara Chapter’s executive committee from 2001-2008 and again from 2014-2015, and also served as the Chapter’s chairperson from 2016-2018. In addition, she established the “Sister Chapter” relationship between the Santa Clara and Malaysian Chapters, supported the Malaysian Chapter’s initial growth, revitalized EPS’ IEMT conference by moving it from the US to Malaysia and established the San Jose State EPS Student Chapter.
Dr. Teng’s contributions to the growth and revitalization of the EPS Monthly Seminar Program at Texas Instruments in Santa Clara significantly increased member attendance. For example, in October 2017 she was the featured speaker at an IEEE event on wafer thinning and singulation — a critical process for successful miniaturization and high-density packaging. Dr. Teng compared dicing yields and cost of various die singulation techniques, including stealth laser, laser ablation, plasma etch, and conventional rotary blade.
Promex is exhibiting in Booth 408 at the Electronic Components and Technology Conference (ECTC) today through Friday, June 1, 2018. Promex specializes in design, packaging, and assembly services for a variety of applications including microelectronic subassemblies; Class II & III implantables and wearables; custom sensors and transducers; microfluidic, ultrasound, and disposable devices; high-resolution imaging arrays; and camera and diagnostic equipment. Also exhibiting in Booth 408 is the Promex Quik-Pak Division, a provider of prototype services for RF devices and sensors supporting 5G and IoT.
Located in Silicon Valley since 1975, Promex provides design for manufacturing services coupled with materials science expertise and broad assembly capabilities for small- to mid-volume onshore production. Services include RoHS-optimized SMT, wafer thinning, dicing, wirebond, flip chip, overmolding, and Class 100/Class 1000 cleanrooms. IC packaging, including over-molded QFNs, are available in five days from the Promex Quik-Pak Division in San Diego. Promex is ISO 13485:2016 and ISO 9001:2015 certified, IPC certified and ITAR registered. For more information: In Booth 408 at ECTC ask for Promex Director of Sales and Marketing Rosie Medina, or visit the Promex website, or call Promex at 408-496-0222.
ECTC brings together the best in packaging, components, and microelectronic systems science, technology, and education in an environment of cooperation and technical exchange. This international event sponsored by the IEEE Electronics Packaging Society (formerly CPMT) runs May 29 – June 1, 2018 at the Sheraton San Diego Hotel & Marina, San Diego, CA. The technical program contains papers covering leading-edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.
SOME Publications and presentations by Promex CTO Dr. Annette Teng
- A. Teng, “Comparison of Dicing Techniques” Luncheon Presentation for IEEE EPS Santa Clara Valley Chapter, Sept. 28th, 2017, Santa Clara, CA. A.Teng,
- “Wafer Singulation and Thinning Technologies” AIM Photonics Fall 2016 Meeting, MIT, MA
- A. Teng, “Thin is In” Luncheon Presentation for IEEE CPMT SCV Chapter, Jan 28th, 2010, Santa Clara, CA.
- A. Teng, “Tutorial on Dicing Technology,” 31st IEEE- International Electronic Manufacturing Technology Symposium, Nov 8th, 2006, Kuala Lumpur, Malaysia.
- A. Teng, “Dicing Die Attach Films for High Volume Stacked Die Application,” 56th IEEE Electronic Components & Technology Conference, May 30th -Jun 2nd, 2006, San Diego, California.
- A. Teng, “Dicing Advanced Materials for Microelectronics,” MEPTEC April 21st, 2005 Phoenix, AZ and MEPTEC April 27th, 2005 Sunnyvale, CA.
- G.W. Xiao, P.C.H.Chan, A. Teng, J. Cai, M.M.F.Yuen, “Effect of Cu Stud Microstructure and Electroplating Process on Intermetallic Compounds Growth and Reliability of Flip-Chip Solder Bump,” IEEE Transactions on Components and Packaging Technologies, Dec 2001, Vol. 24, No. 4. Pp 682-690.
- A. Teng and Y. J. Xu, “Gases Evolved during Cure and Solder Reflow of Encapsulants and Underfills,” 51st Electronic Components & Technology Conference, May 29th-June 1st, 2001, Lake Buena Vista, Florida.
- A. Teng, “Delamination from Process Induced Sources,” 49th Electronic Components & Technology Conference, June 1st-4th, 1999, San Diego, Calif.
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