The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and extraordinarily complex problems. At the heart of this change is the convergence of heterogeneous integration, chiplets, and 3D stacking. But achieving this modularity requires tight coordination across the ecosystem — from substrate design and interposer development to assembly and testing. Put simply, no single company can manage every aspect of the development cycle, no matter how large or advanced they are. In this Semiconductor Engineering article, Dick Otte, president and CEO of Promex Industries, shares his insights on the need for a collaborative ecosystem.