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Promex Expands Die Bonding Capacity, Adds New Capabilities

Oct 13, 2022 | Press Releases, News

State-of-the-art Besi 2200 evo plus die bonder installed at Santa Clara facility SANTA CLARA, Calif., Oct. 4, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has...

Promex Appoints Semiconductor Industry Veteran Chip Greely as VP of Engineering

May 5, 2022 | News, Press Releases

Greely to oversee process development and engineering at Santa Clara facility Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced that longtime semiconductor industry leader Chip...

Industry Veteran Rosie Medina Appointed as VP of Sales and Marketing for Promex Industries, Inc. Divisions

Jul 20, 2021 | Press Releases

Industry Veteran Rosie Medina Appointed as VP of Sales and Marketingfor Promex Industries, Inc. Divisions Medina to lead sales and marketing activities for the company’sPromex Medical and Biotech and QP Technologies Entities SANTA CLARA, Calif. – July 20, 2021 –...

Promex Industries to Showcase Heterogeneous Integration Expertise for Medical Devices at IMAPS Workshop for Advanced Packaging of Medical Microelectronics

Jun 20, 2019 | Press Releases

SANTA CLARA, Calif. – January 27, 2020 – Promex Industries, a biotech microelectronics manufacturer specializing in heterogeneous integration of key subsystems for medical, diagnostic, and life sciences devices, announced its participation in this week’s technical...

Promex CTO Annette Teng Receives EPS Regional Contributions Award for Outstanding Leadership, Impact on Programs and Growth

Jun 1, 2018 | Press Releases

Santa Clara, Calif. – PR NEWSWIRE May 30, 2018 — Promex, a provider of innovative IC packaging and heterogeneous assembly solutions for medical, biotech, and sensor-based microelectronic devices, announces that Promex Chief Technology Officer Annette Teng has been...

Recent Articles

  • Heterogeneous Assembly Datasheet
    April 29, 2021
  • Tissue Marker Case Study
    March 30, 2021
  • Endoscope Camera Assembly
    March 15, 2021
  • Wafer Singulation
    March 1, 2021
  • Unique Assembly and Production Challenges
    February 20, 2021
  • Advances in Medical Device Design
    February 15, 2021
  • Evolving Heterogeneous Integration Roadmap Highlights Trends
    April 15, 2020
  • Heterogenous: It’s More Than Just Integration – It’s Assembly Too
    December 1, 2017
  • Heterogenous assembly new? We’ve been doing it for 20 years!
    September 7, 2017
  • Die Attach Film Applications
    December 1, 2016
About Us
Microelectronic Component Assembly for Medical & Biotech Devices
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Recent Posts

Recent Posts

  • 2023 Chiplet Summit
  • MD&M West
  • ​​iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
  • Webinar: Heterogeneous Integration Manufacturing
Contact Info

  +1 408-496-0222

    info@promex-ind.com

  3075 Oakmead Village Dr.
  Santa Clara, CA 95051
Important Links
  • Careers
  • Site Map
  • Privacy
  • Certifications
  • Contact
Recent Posts

Recent Posts

  • 2023 Chiplet Summit
  • MD&M West
  • ​​iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
  • Webinar: Heterogeneous Integration Manufacturing
Contact Info

  +1 408-496-0222

    info@promex-ind.com

  3075 Oakmead Village Dr.
  Santa Clara, CA 95051