Aug 25, 2023 | Videos, Media Coverage, News, Press Releases
Dick Otte, CEO, and Rosie Medina, Vice President, Sales and Marketing, both at QP Technologies, discuss how the company helps its customers with a range of semiconductor technology solutions, covering wafer preparation, advanced assembly and design, IC packaging and...
Aug 10, 2023 | News, Press Releases
SANTA CLARA, Calif. (August 10, 2023) — Promex, a leader in the assembly of physically small devices that contain semiconductor chips for the medical, biotechnology and communications markets, announced it has named David Fromm its chief operating officer. The...
Apr 19, 2023 | News, Media Coverage, Press Releases
Fromm’s addition greatly enhances microelectronic component assembly capabilities for medtech and biotech markets. SANTA CLARA, Calif., April 19, 2023 – Promex Industries, a Silicon Valley-based provider of advanced microelectronic component assembly and design...
Feb 17, 2023 | Press Releases, News
Nilan tapped to accelerate sales growth and expansion plans SANTA CLARA, Calif., Feb. 7, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced the addition of Vice President of...
Feb 2, 2023 | Press Releases, News
Finetech FINEPLACER® Sigma Bonder Targets Range of Application-Specific Projects State-of-the-art Finetech FINEPLACER® sigma advanced sub-micron bonder installed at Santa Clara facility SANTA CLARA, Calif., Feb. 02, 2023 (GLOBE NEWSWIRE) — Promex Industries, a...
Oct 13, 2022 | Press Releases, News
State-of-the-art Besi 2200 evo plus die bonder installed at Santa Clara facility SANTA CLARA, Calif., Oct. 4, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has...
