Oct 13, 2022 | Press Releases, News
State-of-the-art Besi 2200 evo plus die bonder installed at Santa Clara facility SANTA CLARA, Calif., Oct. 4, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has...
Aug 31, 2022 | Articles & Papers, Articles
Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the...
Aug 4, 2022 | Articles & Papers
In Part 1 of this series, we explored the history of medical innovations and how new approaches, like heterogeneous integration (HI), are poised to enable groundbreaking new treatments. Here, we will expand on the role of HI, as well as the assembly challenges for...
Jul 6, 2022 | Articles, Articles & Papers
There is much to be gained if we combine modern electronic information gathering and analysis capabilities with sensors and communications to diagnose and treat patients. Consider the current situation. Over the last several hundred years, the rate of innovation in...
Jun 15, 2022 | Articles & Papers, Articles
Part Two Part one of this post examined the various aspects associated with selecting a MEMS package and developing an optimal assembly process flow for your unique device. Once you have your MEMS device evaluated, your package chosen and your assembly process flow...
