Can Chiplets Serve Cost-Conscious Apps?

Apr 17, 2025 | Media Coverage

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity,...

Packaging With Fewer People And Better Results

Apr 17, 2025 | Media Coverage

In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in vertically stacked devices, isolate analog or RF functions from digital noise, and align components with...

iMAPS CHIPcon 2025

Apr 11, 2025 | Events

Promex will be exhibiting at CHIPcon 2025 in Dallas, Texas, from July 7-10, 2025. Make sure to stop by and tell us about your latest microelectronics assembly or packaging project, or contact Rosie Media at rmedina@promex-ind.com to set up a meeting. About CHIPcon...

ECTC 2025

Apr 11, 2025 | Events

Promex will be exhibiting at ECTC 2025 in Dallas, Texas, from May 27-30, 2025. We will be at booth #408 with our QP Technologies division. Make sure to stop by and tell us about your latest microelectronics assembly or packaging project, or contact Rosie Media at...

Benefits And Challenges In Multi-Die Assemblies

Apr 2, 2025 | Media Coverage

In part 3 of this Experts at the Table conversation, Semiconductor Engineering discussed chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex...