Jul 29, 2024 | Press Releases, News
Two companies heightening focus on individual core competencies to better pursue rapidly expanding business opportunities. SANTA CLARA, Calif., July 29, 2024 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics...
Jul 23, 2024 | Media Coverage
The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies that can reduce costs and speed time to market. Promex CEO Dick...
Jul 11, 2024 | Media Coverage
Disruptions to the global semiconductor supply chain caused by the COVID-19 pandemic had a severe impact in nearly every sector of the worldwide economy, and especially the worldwide semiconductor market. In this Semiconductor Engineering article, Dave Fromm, head of...
Jun 24, 2024 | Media Coverage
Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field. Promex CEO Dick Otte shared his thoughts on the challenges and...
