New Approaches To Power Decoupling

Oct 24, 2024 | Media Coverage

Decoupling capacitors have long been an important aspect of maintaining a clean power source for integrated circuits, but with noise caused by rising clock frequencies, multiple power domains, and various types of advanced packaging, new approaches are needed. In...

Advanced Packaging Driving New Collaboration Across Supply Chain

Oct 24, 2024 | Media Coverage

The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and extraordinarily complex problems. At the heart of this change is the...

MEDevice 2024

Oct 24, 2024 | Events

Promex will be exhibiting at MEDevice 2024 in Silicon Valley, CA from November 20 – 21, 2024. Stop by booth 1443 and learn how our assembly and packaging services can bring your medical device project from concept to production, or contact Rosie Media at...

Promex 2024 Open House

Oct 24, 2024 | Events

Please join us for a fun evening of Mexican flavor with a Bay Area-influence: Tequila Signature Sangria, Tasty Tacos & Treats, and Tours of our Facility! When: November 20, 2024 from 5:00 – 7:30 pm. Where: 3075 Oakmead Village Drive, Santa Clara, CA, USA...

Emerging Technologies Driving Heterogeneous Integration

Sep 24, 2024 | Media Coverage

As chips are disaggregated into chiplets, more features are being added into these devices that chipmakers were unable to include in the past due to reticle size limits and the high cost of scaling everything to the latest process node. This has opened the door to new...