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All Resources
Articles, News & Press Releases from Promex.
A fully integrated cGMP manufacturer of FDA compliant Class II / III medical device and biotech assemblies located in the heart of Silicon Valley.
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Heterogeneous Chip Assembly Helps Optimize Medical and Wearable Devices
Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the processes associated with assembling these classes of devices.
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Promex Explores Disruptive New Generation of Flexible Hybrid Electronics
Electronics on Everything” may soon be more than just a promise with the advent of flexible hybrid electronics. FHE leverages the low cost of printed plastic film substrates and the performance of semiconductor devices to create a new category of electronics. What...
Promex CEO Richard Otte Presents at IEEE VLSI Test Symposium
The IEEE VLSI Test Symposium tapped Promex President and CEO Richard Otte for a presentation on the status, needs, and potential solutions for testing photonic devices and products. Held earlier this month in San Francisco, the symposium explored emerging trends...
Heterogenous: It’s More Than Just Integration – It’s Assembly Too
by Promex President and CEO Richard Otte The increased functionality of today's devices is mind-boggling. They go well beyond utilizing just electronics. Optical devices analyze chemicals, toxins, and biologic specimens. Semiconductor devices control and switch...
Heterogenous assembly new? We’ve been doing it for 20 years!
by: Dick Otte, President & CEO Ninety percent of contract manufacturers make devices that are little more than metal boxes with stuff in them. The other ten percent offer specialized processes. Then there is the rare breed of microelectronics assembly services...
Developing new medical devices? Start with a free design review for reliability and manufacturability.
by: Rosie Medina, Director Sales & Marketing Medical devices and biotech systems often involve people, animals, bacteria, viruses, and other living entities lacking standard electrical connectors. Instead, they use sensors, actuators, antennas, and probes to...
Even if all you’ve got for your new 5G product is a proof of concept, we can help accelerate the process
by: Dick Otte, President & CEO Annual revenues for 5G services and products are estimated to reach $250 billion by 2025. No wonder manufacturers are racing to be first to market. These new function-rich 5G products will incorporate more sensors and devices and...
Die Attach Film Applications
"Die Attach Film Applications" By Promex CTO Annette TengPublished in MEPTEC Report Winter 2016 Die attach film (DAF) and dicing die attach film (DDAF) have been commercially available since 2000. Epoxy paste adhesives have historically been the sole epoxy material...
Promex Industries Acquires Quik-Pak, a Division of Delphon
Santa Clara, CA, April 1, 2015: Promex Industries, announced today the acquisition of San Diego based Quik-Pak, a division of Delphon. Quik-Pak will retain its San Diego, CA location and operate as a division of Promex. The combined entities are now able to offer...
Advances in Medical Device Package Manufacturing
“Advances in Medical Device Package Manufacturing” by Former Promex Chief Technology Officer Dr. Edward S. Binkley. Presented at the MEPTEC Packaging Symposium, October 2014.Here's a downloadable version (.pdf) of the paper:[pdf-embedder...
Development Status of an OCCAM Electronic Assembly Method
"Development Status of an OCCAM Electronic Assembly Method" by Promex CEO Richard F. Otte and Former Chief Technology Officer Dr. Edward S. Binkley. Published June 2014.Here's a downloadable version (.pdf) of the paper:[pdf-embedder...
A Simplified QFN Package Characterization Technique
"A Simplified QFN Package Characterization Technique” by Promex CEO Richard F. Otte and by Dr. Eric Bogatin and Trevor Mitchell, Bogatin Enterprises. Published August 2010. This technique was used to characterize the electrical parasitics (R, C, and L vs frequency)...
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