Apr 19, 2023 | News, Media Coverage, Press Releases
Fromm’s addition greatly enhances microelectronic component assembly capabilities for medtech and biotech markets. SANTA CLARA, Calif., April 19, 2023 – Promex Industries, a Silicon Valley-based provider of advanced microelectronic component assembly and design...
Mar 22, 2023 | Media Coverage
When it comes to device interconnects, it’s hard to beat copper. Its low resistivity and high reliability have served the industry exceedingly well as both on-chip interconnect and wires between chips. But in logic chips, with interconnect stacks rising into the...
Mar 20, 2023 | Media Coverage
Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows and fueled by combinations of hardened IP that have been proven in silicon. Dick Otte, CEO of Promex Industries, shared his...
Feb 16, 2023 | Media Coverage
Heterogeneous integration and increasing density at advanced nodes are creating some complex and difficult challenges for IC manufacturing and packaging. Chip Greely, vice president of engineering at Promex, offered insights into this issue to Semiconductor...
Feb 7, 2023 | Media Coverage
Thermal stress is a well-known problem in advanced packaging, along with the challenges of mechanical stress. Both are exacerbated by heterogenous integration, which often requires mingling materials with incompatible coefficients of thermal expansion (CTE). Chip...
Jan 19, 2023 | Media Coverage
Dick Otte, CEO of Promex Industries, sat down with Semiconductor Engineering to talk about unknowns in material properties, the impact on bonding, and why environmental factors are so important in complex heterogeneous packages. What follows are excerpts of that...
