May 17, 2023 | Media Coverage, News
For more than 50 years, designers of computer chips mainly used one tactic to boost performance: They shrank electronic components to pack more power onto each piece of silicon. Then more than a decade ago, engineers at the chip maker Advanced Micro Devices began...
May 17, 2023 | Articles & Papers, Media Coverage
By Dick Otte, CEO, Promex Industries Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these...
Apr 19, 2023 | News, Media Coverage, Press Releases
Fromm’s addition greatly enhances microelectronic component assembly capabilities for medtech and biotech markets. SANTA CLARA, Calif., April 19, 2023 – Promex Industries, a Silicon Valley-based provider of advanced microelectronic component assembly and design...
Feb 2, 2023 | Press Releases, News
Finetech FINEPLACER® Sigma Bonder Targets Range of Application-Specific Projects State-of-the-art Finetech FINEPLACER® sigma advanced sub-micron bonder installed at Santa Clara facility SANTA CLARA, Calif., Feb. 02, 2023 (GLOBE NEWSWIRE) — Promex Industries, a...
