Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. In this Semiconductor Engineering article, Dick Otte, CEO of Promex,...

Medical devices are getting smaller, smarter, and more powerful – much like the evolution of computers. In fact, many of today’s microelectronic-containing medical devices act very much like minicomputers -- sensing, seeing, gathering and sharing data, from both...

The semiconductor industry is converging on 3.5D as the next best option in advanced packaging, a hybrid approach that includes stacking logic chiplets and bonding them separately to a substrate shared by other components. In this Semiconductor Engineering article,...

High-volume products get more than their fair share of attention in the semiconductor world, but most chips don’t fit into that category. While a few huge fabs and offshore assembly and test (OSAT) houses process enormous volumes of chips, small fabs and packaging...

Mechanical tolerance issues can wreak havoc on manufacturing your integrated microelectronic medical device, adding unnecessary costs and delays throughout the product development process and negatively impacting final functional yield. Promex COO and VP of...

Sensor packaging, particularly for microelectromechanical systems (MEMS), is a critical aspect of modern electronics. MEMS developers have demonstrated a variety of innovative microsensors for almost every possible sensing modality including temperature, pressure,...

The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies that can reduce costs and speed time to market. Promex CEO Dick...

Disruptions to the global semiconductor supply chain caused by the COVID-19 pandemic had a severe impact in nearly every sector of the worldwide economy, and especially the worldwide semiconductor market. In this Semiconductor Engineering article, Dave Fromm, head...

Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field. Promex CEO Dick Otte shared his thoughts on the challenges and...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of challenges that will take years to fully resolve. Dave Fromm, COO at...

The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various technologies and device nodes can be integrated in a single package...

With a unique factory setting featuring cutting-edge equipment and meticulous supply chain management, Promex partners with med and biotech companies at all stages in the assembly process, from early prototypes to R&D development and high-volume production....

Circuit scaling is starting to hit a wall as the laws of physics clash with exponential increases in the volume of data, forcing chipmakers to take a much closer look at silicon photonics as a way of moving data from where it is collected to where it is processed...

Medical device designers’ goals have always been enhancing and enriching device functionality while reducing size and cost. This is particularly true as modern devices start acting like complex miniaturized computers for the body, interfaced with microelectronic...

The electronics industry began using the term heterogeneous integration (HI) about five years ago to describe a new approach to building semiconductor devices that would allow for greater density and capability. The legacy approach to making transistors, lines, and...

In the realm of electronics and semiconductors, a silent revolution is underway, one marked not by the grandeur of size, but by the subtlety of miniaturization. This long-term trend toward smaller, more compact devices is not just a technological feat; it’s a...

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant issues over how to manage the thermal load. Dave Fromm, COO and vice...