Heterogenous Integration
Today’s advanced devices combine electronics with multiple technologies, such as optical, chemical, liquid, and radiofrequency (RF) elements, to increase functionality or interaction with the environment. To produce these devices, these technologies must be combined cost-effectively – ideally, utilizing a heterogeneous integration development cycle to minimize time to market.
Heterogenous Integration
Today’s advanced devices combine electronics with multiple technologies, such as optical, chemical, liquid, and radiofrequency (RF) elements, to increase functionality or interaction with the environment. To produce these devices, these technologies must be combined cost-effectively – ideally, utilizing a heterogeneous integration development cycle to minimize time to market.
Combining technologies, as well as combining components with electronics, requires improved design methods and software, more material properties, longer supply chains, and a sophisticated manufacturing process that we call heterogeneous assembly. At Promex, we specialize in this approach, leveraging our packaging and assembly expertise to go beyond the mechanics of electronic assembly and address the unique requirements of your heterogeneously integrated devices.
Subassembly Using SMT Processes
We perform subassembly using surface-mount technology (SMT) processes. Starting with the substrate, we move to solder dispensing, then to part placement, solder reflow, cleaning, and inspection. Throughout, we collaborate with you while leveraging our assembly expertise to select the optimal materials and processes for each step. Following inspection, the completed SMT assembly moves on to the next process.
Wafer Processing Through Encapsulation
For this series of steps, we start with backgrinding to think the wafer, we can apply a laminate die-attach film (DAF), then sawing/singulation. At this point, the SMT assembly is brought in for die attach with precision die alignment and placement. Next comes curing of epoxy, or flip chip reflow, followed by plasma cleaning, wire bonding, and encapsulation. Once the encapsulate is cured, your project moves on to further special processing as needed.
Specialized Part Placement and Attach
Specialized parts or functions that you may need for your project include fluid seals, glass parts, optical filters, mechanical mounts, optical fibers, or heatsinks, as well as specialized devices such as image sensors or microelectromechanical systems (MEMS). We can accommodate these parts with corresponding specialized process requirements, moving them to final testing so you can get your product to market as quickly as possible.
Some Unique Processes Developed for Customers
This process of heterogeneous assembly often starts with a conventional SMT process or assembly on a 300 mm wafer. The resulting subassembly can be used as a platform on which standard or custom die are attached and connected specialized parts are added.
Here are some examples of heterogeneous assembly solutions that Promex has created for real-world applications. Whatever your specialized component requirements, we can develop an approach that will save you time, money, and headaches.
- Hexagonal-shaped die
- Light pipes optically connected to sources and detectors
- Low-temperature gold wire bonding to avoid damaging chemistry
- Highly controlled electrostatic discharge (ESD) environment to enable packaging die that do not have ESD protection
- Storage in refrigerator and processing at room temperature to avoid aging chemistry on devices
- Adding a protective coating to prevent water damage to chemistry on wafers during sawing
- Developing a method of placing lids on 300 mm wafer sites with a fluid-tight channel
Typical Clients
