Jan 19, 2023 | Media Coverage
Chiplets and heterogenous integration (HI) provide a compelling way to continue delivering improvements in performance, power, area, and cost (PPAC) as Moore’s Law slows, but choosing the best way to connect these devices so they behave in consistent and predictable...
Sep 2, 2021 | Media Coverage, Videos
A 55-minute audio discussion with the CEO of Promex, Dick Otte The acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors (FABS)...
