May 18, 2023 | Media Coverage
Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these markets present a variety of...
May 18, 2023 | Media Coverage
New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. Jeff Schaefer, senior process engineer at Promex Industries, shared insights into this...
May 17, 2023 | Media Coverage, News
For more than 50 years, designers of computer chips mainly used one tactic to boost performance: They shrank electronic components to pack more power onto each piece of silicon. Then more than a decade ago, engineers at the chip maker Advanced Micro Devices began...
May 17, 2023 | Articles & Papers, Media Coverage
By Dick Otte, CEO, Promex Industries Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these...
May 11, 2023 | Media Coverage
Chiplets, a way to design chips for higher performance, has become a key prong of U.S. industrial policy. But pushing for more of this activity domestically is challenging. Dick Otte, CEO of Promex Industries, shared his insights into this challenge with The New York...
May 9, 2023 | Media Coverage
Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers. Jeff Schaefer, senior process engineer of Promex Industries, shared insights into this challenge in this Semiconductor...
