Apr 15, 2020 | Articles, Articles & Papers
by: Annette Teng, CTO, Promex/Quik-Pak As noted in last month’s blog post, the semiconductor industry has turned its efforts toward the ongoing fleshing out of a roadmap focused on advancing heterogeneous integration (HI). HI integrates separately manufactured...
Sep 7, 2017 | Articles & Papers
by: Dick Otte, President & CEO Ninety percent of contract manufacturers make devices that are little more than metal boxes with stuff in them. The other ten percent offer specialized processes. Then there is the rare breed of microelectronics assembly services...
Sep 6, 2017 | Articles & Papers
by: Rosie Medina, Director Sales & Marketing Medical devices and biotech systems often involve people, animals, bacteria, viruses, and other living entities lacking standard electrical connectors. Instead, they use sensors, actuators, antennas, and probes to...
Aug 21, 2017 | Articles & Papers
by: Dick Otte, President & CEO Annual revenues for 5G services and products are estimated to reach $250 billion by 2025. No wonder manufacturers are racing to be first to market. These new function-rich 5G products will incorporate more sensors and devices and...
Dec 1, 2016 | White Papers, Articles & Papers
“Die Attach Film Applications” By Promex CTO Annette TengPublished in MEPTEC Report Winter 2016 Die attach film (DAF) and dicing die attach film (DDAF) have been commercially available since 2000. Epoxy paste adhesives have historically been the sole epoxy...
