Mar 1, 2021 | Articles, Videos
A short video looking at how blade dicing remains the optimal solution for wafer singulation in most cases. Singulation is the process of dicing a silicon wafer into individual units and is a critical step in assembly and packaging. Dicing technology has continued...
Feb 20, 2021 | Articles, Articles & Papers
Here are some of unique assembly and production challenges we can solve: The smaller the better. We worked with the customer to design an optical Class 3 device that would be inserted into the human body. Requirements included Class 100 assembly and strict...
Feb 15, 2021 | Articles, Articles & Papers, Videos
A short video of how advances in semiconductor assembly and fabrication are re-shaping medical device design: Advances in semiconductor assembly and fabrication are offering medical device designers new options for smaller, more compact, and more sophisticated...
