2025 Viewpoint: The Future of Flex Is Here

Each year, Semiconductor Digest turns to industry leaders and analysts to get their viewpoints on what they expect to see in the coming year in terms of critical tech and business trends. Promex COO Dave Fromm provided his insights on the growing demand for complex...

Navigating Increased Complexity In Advanced Packaging

As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it means to achieve precision, forcing companies to rethink everything...