iMAPS CHIPcon 2025

Apr 11, 2025 | Events

Promex will be exhibiting at CHIPcon 2025 in Dallas, Texas, from July 7-10, 2025. Make sure to stop by and tell us about your latest microelectronics assembly or packaging project, or contact Rosie Media at rmedina@promex-ind.com to set up a meeting. About CHIPcon...

ECTC 2025

Apr 11, 2025 | Events

Promex will be exhibiting at ECTC 2025 in Dallas, Texas, from May 27-30, 2025. We will be at booth #408 with our QP Technologies division. Make sure to stop by and tell us about your latest microelectronics assembly or packaging project, or contact Rosie Media at...

Benefits And Challenges In Multi-Die Assemblies

Apr 2, 2025 | Media Coverage

In part 3 of this Experts at the Table conversation, Semiconductor Engineering discussed chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex...

Big Changes Ahead For Interposers And Substrates

Mar 24, 2025 | Media Coverage

Interposers and substrates are evolving from passive connectors into advanced platforms that manage power, heat, and high-density interconnects in cutting-edge computing systems. Driven by AI and HPC demands, this shift addresses the widening gap between shrinking...

What Exactly Are Chiplets And Heterogeneous Integration?

Mar 20, 2025 | Media Coverage

The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they’re reading. But speakers sometimes stumble during a presentation trying to figure out whether a...