Aug 21, 2024 | Media Coverage
The semiconductor industry is converging on 3.5D as the next best option in advanced packaging, a hybrid approach that includes stacking logic chiplets and bonding them separately to a substrate shared by other components. In this Semiconductor Engineering article,...
Aug 15, 2024 | Media Coverage
High-volume products get more than their fair share of attention in the semiconductor world, but most chips don’t fit into that category. While a few huge fabs and offshore assembly and test (OSAT) houses process enormous volumes of chips, small fabs and packaging...
Aug 8, 2024 | Media Coverage
Mechanical tolerance issues can wreak havoc on manufacturing your integrated microelectronic medical device, adding unnecessary costs and delays throughout the product development process and negatively impacting final functional yield. Promex COO and VP of...
Aug 1, 2024 | Media Coverage
Sensor packaging, particularly for microelectromechanical systems (MEMS), is a critical aspect of modern electronics. MEMS developers have demonstrated a variety of innovative microsensors for almost every possible sensing modality including temperature, pressure,...
Jul 29, 2024 | Press Releases, News
Two companies heightening focus on individual core competencies to better pursue rapidly expanding business opportunities. SANTA CLARA, Calif., July 29, 2024 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics...
