Blog: Using Glass as a Dielectric in Electronic Packaging

Feb 19, 2025 | Articles

By: Dick Otte, CEO of Promex Industries As demand for higher-performance, more compact and energy-efficient electronics continues to escalate, traditional organic based substrates are approaching practical limitations, leading to industry experimentation with...

What’s Next In Advanced Packaging?

Feb 19, 2025 | Media Coverage

Semiconductor Engineering sat down with advanced packaging experts to discuss 3D-IC progress and issues, photonics, and tradeoffs with different interposers and bridge technologies; featuring: Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor;...

Benefits and Challenges of Sensors that Utilize Chips and MEMS

Feb 4, 2025 | Media Coverage

Semiconductor chips, including microelectromechanical systems (MEMS), have revolutionized sensors in recent times. The inclusion in sensors of these miniature semiconductor and mechanical devices enables detection, analysis, communication and physical motion...

Advanced Packaging Moving At Breakneck Pace

Jan 29, 2025 | Media Coverage

Semiconductor Engineering sat down to discuss advances in packaging with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director...

Electrifying Everything: Power Moves Toward ICs

Jan 23, 2025 | Media Coverage

As electronic systems grow increasingly complex and energy-intensive, traditional power management methods — centered on centralized systems and external components — are proving inadequate. More data needs to be processed in less time with more and often smaller...