Cooling Chips Still A Top Challenge

Increasing levels of semiconductor integration means more work needs to be done in smaller spaces, which in turn generates more heat that needs to be dissipated. Managing heat dissipation in advanced node dies and in multi-die assemblies is critical to their...

The Engineer Behind 50 Years of Medtech Innovation

With more than 75 patents, Promex CEO Dick Otte helped shape the medical devices used today. In this Q&A with 24×7 magazine, he shares how engineering decisions have lasting effects on performance, serviceability, and the evolution of medtech. Read the full...