Die Attach Film Applications

Dec 1, 2016 | White Papers, Articles & Papers

“Die Attach Film Applications” By Promex CTO Annette TengPublished in MEPTEC Report Winter 2016 Die attach film (DAF) and dicing die attach film (DDAF) have been commercially available since 2000. Epoxy paste adhesives have historically been the sole epoxy...

Promex Industries Acquires Quik-Pak, a Division of Delphon

Apr 1, 2015 | News

​Santa Clara, CA, April 1, 2015: Promex Industries, announced today the acquisition of San Diego based Quik-Pak, a division of Delphon. Quik-Pak will retain its San Diego, CA location and operate as a division of Promex. The combined entities are now able to offer a...

Advances in Medical Device Package Manufacturing

Oct 1, 2014 | White Papers, Articles & Papers

“Advances in Medical Device Package Manufacturing” by Former Promex Chief Technology Officer Dr. Edward S. Binkley. Presented at the MEPTEC Packaging Symposium, October 2014. Here’s a downloadable version (.pdf) of the paper: Getting Started Concept to...

Development Status of an OCCAM Electronic Assembly Method

Jun 1, 2014 | White Papers, Articles & Papers

“Development Status of an OCCAM Electronic Assembly Method” by Promex CEO Richard F. Otte and Former Chief Technology Officer Dr. Edward S. Binkley. Published June 2014. Here’s a downloadable version (.pdf) of the paper: Getting Started Concept to...

A Simplified QFN Package Characterization Technique

Aug 1, 2010 | White Papers, Articles & Papers

“A Simplified QFN Package Characterization Technique” by Promex CEO Richard F. Otte and by Dr. Eric Bogatin and Trevor Mitchell, Bogatin Enterprises. Published August 2010. This technique was used to characterize the electrical parasitics (R, C, and L vs...