Interposers and substrates are evolving from passive connectors into advanced platforms that manage power, heat, and high-density interconnects in cutting-edge computing systems. Driven by AI and HPC demands, this shift addresses the widening gap between shrinking silicon nodes and limited PCB capabilities, enabling new packaging solutions like ultra-fine RDLs, hybrid bonding, and glass substrates for chiplet-based architectures. In this Semiconductor Engineering article, Promex CEO Dick Otte shares insights on how the industry is adapting to these changes.