As electronic systems grow increasingly complex and energy-intensive, traditional power management methods — centered on centralized systems and external components — are proving inadequate. More data needs to be processed in less time with more and often smaller transistors, and providing them with sufficient and consistent power is an increasingly complex and essential task. In this Semiconductor Engineering article, Promex CEO Dick Otte comments on the cross-disciplinary collaboration needed to overcome advanced packaging challenges facing electrification and integrated power solutions.