Some complexities of integrating miniaturized components, such as microelectronics, into increasingly small medical devices are obvious. Examples include the precision required to position and align components with the requisite accuracy, or the identification of critical-to-function dimensions and methods that control and check assembly steps. In his article for Medical Design & Outsourcing, Dave Fromm, Promex’s COO, explains how understanding and managing thermally induced dynamics during assembly and use is essential as devices become increasingly integrated and miniaturized.