Decoupling capacitors have long been an important aspect of maintaining a clean power source for integrated circuits, but with noise caused by rising clock frequencies, multiple power domains, and various types of advanced packaging, new approaches are needed. In...

The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and extraordinarily complex problems. At the heart of this change is the...

As chips are disaggregated into chiplets, more features are being added into these devices that chipmakers were unable to include in the past due to reticle size limits and the high cost of scaling everything to the latest process node. This has opened the door to...

Dick Otte, CEO of Promex Industries and QP Technologies, sat down with Semiecosystem to discuss traditional chip scaling, chiplets, mature package types, and reshoring, as well as the issues in packaging for medical devices and compound semiconductors. Read the...

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. In this Semiconductor Engineering article, Dick Otte, CEO of Promex,...

Medical devices are getting smaller, smarter, and more powerful – much like the evolution of computers. In fact, many of today’s microelectronic-containing medical devices act very much like minicomputers -- sensing, seeing, gathering and sharing data, from both...

The semiconductor industry is converging on 3.5D as the next best option in advanced packaging, a hybrid approach that includes stacking logic chiplets and bonding them separately to a substrate shared by other components. In this Semiconductor Engineering article,...

High-volume products get more than their fair share of attention in the semiconductor world, but most chips don’t fit into that category. While a few huge fabs and offshore assembly and test (OSAT) houses process enormous volumes of chips, small fabs and packaging...

Mechanical tolerance issues can wreak havoc on manufacturing your integrated microelectronic medical device, adding unnecessary costs and delays throughout the product development process and negatively impacting final functional yield. Promex COO and VP of...

Sensor packaging, particularly for microelectromechanical systems (MEMS), is a critical aspect of modern electronics. MEMS developers have demonstrated a variety of innovative microsensors for almost every possible sensing modality including temperature, pressure,...

Decoupling capacitors have long been an important aspect of maintaining a clean power source for integrated circuits, but with noise caused by rising clock frequencies, multiple power domains, and various types of advanced packaging, new approaches are needed. In...

The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and extraordinarily complex problems. At the heart of this change is the...

As chips are disaggregated into chiplets, more features are being added into these devices that chipmakers were unable to include in the past due to reticle size limits and the high cost of scaling everything to the latest process node. This has opened the door to...

Dick Otte, CEO of Promex Industries and QP Technologies, sat down with Semiecosystem to discuss traditional chip scaling, chiplets, mature package types, and reshoring, as well as the issues in packaging for medical devices and compound semiconductors. Read the...

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. In this Semiconductor Engineering article, Dick Otte, CEO of Promex,...

Medical devices are getting smaller, smarter, and more powerful – much like the evolution of computers. In fact, many of today’s microelectronic-containing medical devices act very much like minicomputers -- sensing, seeing, gathering and sharing data, from both...

The semiconductor industry is converging on 3.5D as the next best option in advanced packaging, a hybrid approach that includes stacking logic chiplets and bonding them separately to a substrate shared by other components. In this Semiconductor Engineering article,...

High-volume products get more than their fair share of attention in the semiconductor world, but most chips don’t fit into that category. While a few huge fabs and offshore assembly and test (OSAT) houses process enormous volumes of chips, small fabs and packaging...

Mechanical tolerance issues can wreak havoc on manufacturing your integrated microelectronic medical device, adding unnecessary costs and delays throughout the product development process and negatively impacting final functional yield. Promex COO and VP of...

Sensor packaging, particularly for microelectromechanical systems (MEMS), is a critical aspect of modern electronics. MEMS developers have demonstrated a variety of innovative microsensors for almost every possible sensing modality including temperature, pressure,...