Promex Newsroom
Promex Newsroom
Keep up with the latest company news, industry media, and press releases from Promex – a leader in sophisticated miniaturization technology.
Featured News
Promex Industries and QP Technologies Appoint Jeannine Serbanich as Vice President of Finance
Experienced Financial Executive to Streamline Companies’ Financial Processes, Partnering with Leadership Team to Drive Improved Performance ESCONDIDO, Calif. – December 4, 2024 – Microelectronics and packaging assembly leaders Promex Industries, Inc., and its QP...
Browse News, Events, Media & Press
Promex 2024 Open House
Please join us for a fun evening of Mexican flavor with a Bay Area-influence: Tequila Signature Sangria, Tasty Tacos & Treats, and Tours of our Facility! When: November 20, 2024 from 5:00 - 7:30 pm. Where: 3075 Oakmead Village Drive, Santa Clara, CA, USA...
Emerging Technologies Driving Heterogeneous Integration
As chips are disaggregated into chiplets, more features are being added into these devices that chipmakers were unable to include in the past due to reticle size limits and the high cost of scaling everything to the latest process node. This has opened the door to...
Issues and Challenges with IC Packaging
Dick Otte, CEO of Promex Industries and QP Technologies, sat down with Semiecosystem to discuss traditional chip scaling, chiplets, mature package types, and reshoring, as well as the issues in packaging for medical devices and compound semiconductors. Read the...
How Die Dimensions Challenge Assembly Processes
Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. In this Semiconductor Engineering article, Dick Otte, CEO of Promex,...
Getting a complex medical device across the finish line is easier when you pass through multiple gates
Medical devices are getting smaller, smarter, and more powerful – much like the evolution of computers. In fact, many of today’s microelectronic-containing medical devices act very much like minicomputers -- sensing, seeing, gathering and sharing data, from both...
3.5D: The Great Compromise
The semiconductor industry is converging on 3.5D as the next best option in advanced packaging, a hybrid approach that includes stacking logic chiplets and bonding them separately to a substrate shared by other components. In this Semiconductor Engineering article,...
Why Small Fab And Assembly Houses Are Thriving
High-volume products get more than their fair share of attention in the semiconductor world, but most chips don’t fit into that category. While a few huge fabs and offshore assembly and test (OSAT) houses process enormous volumes of chips, small fabs and packaging...
How Does Your Med Device Stack Up?
Mechanical tolerance issues can wreak havoc on manufacturing your integrated microelectronic medical device, adding unnecessary costs and delays throughout the product development process and negatively impacting final functional yield. Promex COO and VP of...
Sensor Packaging: Critical MEMS Considerations
Sensor packaging, particularly for microelectromechanical systems (MEMS), is a critical aspect of modern electronics. MEMS developers have demonstrated a variety of innovative microsensors for almost every possible sensing modality including temperature, pressure,...
Promex Industries and QP Technologies Implement Sales/Marketing Reorganization, Promoting Rosie Medina to Promex Senior Vice President and Matt Hansen to QP Technologies Vice President
Two companies heightening focus on individual core competencies to better pursue rapidly expanding business opportunities. SANTA CLARA, Calif., July 29, 2024 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics...
Precision Patterning Options Emerge For Advanced Packaging
The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies that can reduce costs and speed time to market. Promex CEO Dick...
Promex 2024 Open House
Please join us for a fun evening of Mexican flavor with a Bay Area-influence: Tequila Signature Sangria, Tasty Tacos & Treats, and Tours of our Facility! When: November 20, 2024 from 5:00 - 7:30 pm. Where: 3075 Oakmead Village Drive, Santa Clara, CA, USA...
Emerging Technologies Driving Heterogeneous Integration
As chips are disaggregated into chiplets, more features are being added into these devices that chipmakers were unable to include in the past due to reticle size limits and the high cost of scaling everything to the latest process node. This has opened the door to...
Issues and Challenges with IC Packaging
Dick Otte, CEO of Promex Industries and QP Technologies, sat down with Semiecosystem to discuss traditional chip scaling, chiplets, mature package types, and reshoring, as well as the issues in packaging for medical devices and compound semiconductors. Read the...
How Die Dimensions Challenge Assembly Processes
Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. In this Semiconductor Engineering article, Dick Otte, CEO of Promex,...
Getting a complex medical device across the finish line is easier when you pass through multiple gates
Medical devices are getting smaller, smarter, and more powerful – much like the evolution of computers. In fact, many of today’s microelectronic-containing medical devices act very much like minicomputers -- sensing, seeing, gathering and sharing data, from both...
3.5D: The Great Compromise
The semiconductor industry is converging on 3.5D as the next best option in advanced packaging, a hybrid approach that includes stacking logic chiplets and bonding them separately to a substrate shared by other components. In this Semiconductor Engineering article,...
Why Small Fab And Assembly Houses Are Thriving
High-volume products get more than their fair share of attention in the semiconductor world, but most chips don’t fit into that category. While a few huge fabs and offshore assembly and test (OSAT) houses process enormous volumes of chips, small fabs and packaging...
How Does Your Med Device Stack Up?
Mechanical tolerance issues can wreak havoc on manufacturing your integrated microelectronic medical device, adding unnecessary costs and delays throughout the product development process and negatively impacting final functional yield. Promex COO and VP of...
Sensor Packaging: Critical MEMS Considerations
Sensor packaging, particularly for microelectromechanical systems (MEMS), is a critical aspect of modern electronics. MEMS developers have demonstrated a variety of innovative microsensors for almost every possible sensing modality including temperature, pressure,...
Promex Industries and QP Technologies Implement Sales/Marketing Reorganization, Promoting Rosie Medina to Promex Senior Vice President and Matt Hansen to QP Technologies Vice President
Two companies heightening focus on individual core competencies to better pursue rapidly expanding business opportunities. SANTA CLARA, Calif., July 29, 2024 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics...
Precision Patterning Options Emerge For Advanced Packaging
The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies that can reduce costs and speed time to market. Promex CEO Dick...