Blog: Setting the Standard in Microelectronics Die Preparation

Jun 23, 2025 | Articles

Die preparation is a vital step in semiconductor device manufacturing, comprising a series of precision processes that transform delicate wafers into reliable, high-yield dies ready for advanced packaging. At Promex, die preparation is a core strength of our packaging...

Blog: Using Glass as a Dielectric in Electronic Packaging

Feb 19, 2025 | Articles

By: Dick Otte, CEO of Promex Industries As demand for higher-performance, more compact and energy-efficient electronics continues to escalate, traditional organic based substrates are approaching practical limitations, leading to industry experimentation with...

Blog: Advancing Medical Devices through Heterogeneous Integration

Jan 3, 2025 | Articles

As medical treatments continue to evolve, innovation in medical devices plays a vital role, enabling increasingly complex, precise, and safer interventions. For example: Endoscopic devices provide high-resolution in vivo imaging, Wearable sensors offer real-time...

Heterogeneous Chip Assembly Helps Optimize Medical and Wearable Devices

Aug 31, 2022 | Articles & Papers, Articles

Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the...

Heterogeneous Integration: Fertile Ground for Medical & Biotech Innovation

Jul 6, 2022 | Articles, Articles & Papers

There is much to be gained if we combine modern electronic information gathering and analysis capabilities with sensors and communications to diagnose and treat patients. Consider the current situation. Over the last several hundred years, the rate of innovation in...

Solving the Challenges of MEMS Device Assembly: Part Two

Jun 15, 2022 | Articles & Papers, Articles

Part Two Part one of this post examined the various aspects associated with selecting a MEMS package and developing an optimal assembly process flow for your unique device. Once you have your MEMS device evaluated, your package chosen and your assembly process flow...