Stress-Free Precision: How UV Laser Depaneling Helps Promex’s Customers Achieve Reliable, Next-Gen Designs

At Promex, we know that reliability and precision are everything in microelectronics manufacturing. That’s why we invested in the LPKF CuttingMaster 2127 UV laser depaneling system (27 W, 355 nm nanosecond pulse, <20 µm spot size)—to give our customers a better path to high-yield, high-reliability assemblies

Why This Matters for You

Traditional mechanical depaneling can create stress, delamination, or microcracks that compromise device performance. For customers working with flex circuits, LCP, polyimide substrates, or thin laminates, this risk can mean costly redesigns or lost reliability in the field.

The CuttingMaster 2127 is designed for cleanly and quickly cutting organic materials without melting, charring, or thermal stress, making it ideal for:

• FR4 circuit boards
• Polyimide flex boards
• Liquid crystal polymer (LCP) flex boards
• Organic/laminate substrates and interposers
• Overmolded components and other plastics/composites

Capabilities that Expand Design Freedom

With this tool, Promex can now offer both prototype and production services that directly benefit customers:

• Circuit board depanelization (panel sizes up to 350 mm × 350 mm; thickness up to 1.6 mm, thicker upon request)
• Positional accuracy of ±25 µm and the ability to allow components within 30 µm of the PCB edge
• Panelization layout support – accepts AutoCAD (.dxf/.dwg) and Gerber (.gbr) files
• Up to 30% less dead space between devices on a panel thanks to the small laser spot size
• Laser drilling and rework (trace cutting, solder mask removal)
• Serialization and marking – including 1D/2D barcodes, data matrix, QR codes, numerical serialization, and even logos or artwork
• Process development and feasibility studies for new materials or custom requirements

Faster Ramp to Production

Because the CuttingMaster is fast to set up and switch between jobs, Promex can move your product from prototype to production more quickly. Customers gain:

• Shorter turnaround times
• Improved process control (no more outsourcing depaneling)
• Consistent quality across materials and builds

Built for Your Industry’s Demands

• Medical devices: stress-free depaneling for safe, high-reliability implantables and wearables.
• Space systems: precision cutting that meets mission-critical standards.
• AI and advanced computing: enabling compact, high-density electronics packaging.

The Promex Promise

By bringing UV laser depaneling in-house, Promex is not just improving manufacturing—we’re removing barriers for our customers. Whether you’re developing a life-saving medical implant, a next-generation space payload, or high-performance AI hardware, our processes give you the design freedom and reliability margin to succeed.