Articles & White Papers
Articles & White Papers
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White Paper: Advanced Packaging for Medical Microelectronics
Sensors and microelectromechanical systems (MEMS) are enabling more complex designs of miniature devices in healthcare, smart systems, and consumer electronics. To navigate the challenge of building these devices, it’s essential to partner with an expert in...
Browse Articles & White Papers
Die Attach Film Applications
"Die Attach Film Applications" By Promex CTO Annette TengPublished in MEPTEC Report Winter 2016 Die attach film (DAF) and dicing die attach film (DDAF) have been commercially available since 2000. Epoxy paste adhesives have historically been the sole epoxy material...
Advances in Medical Device Package Manufacturing
“Advances in Medical Device Package Manufacturing” by Former Promex Chief Technology Officer Dr. Edward S. Binkley. Presented at the MEPTEC Packaging Symposium, October 2014.Here's a downloadable version (.pdf) of the paper:[pdf-embedder...
Development Status of an OCCAM Electronic Assembly Method
"Development Status of an OCCAM Electronic Assembly Method" by Promex CEO Richard F. Otte and Former Chief Technology Officer Dr. Edward S. Binkley. Published June 2014.Here's a downloadable version (.pdf) of the paper:[pdf-embedder...
A Simplified QFN Package Characterization Technique
"A Simplified QFN Package Characterization Technique” by Promex CEO Richard F. Otte and by Dr. Eric Bogatin and Trevor Mitchell, Bogatin Enterprises. Published August 2010. This technique was used to characterize the electrical parasitics (R, C, and L vs frequency)...
Die Attach Film Applications
"Die Attach Film Applications" By Promex CTO Annette TengPublished in MEPTEC Report Winter 2016 Die attach film (DAF) and dicing die attach film (DDAF) have been commercially available since 2000. Epoxy paste adhesives have historically been the sole epoxy material...
Advances in Medical Device Package Manufacturing
“Advances in Medical Device Package Manufacturing” by Former Promex Chief Technology Officer Dr. Edward S. Binkley. Presented at the MEPTEC Packaging Symposium, October 2014.Here's a downloadable version (.pdf) of the paper:[pdf-embedder...
Development Status of an OCCAM Electronic Assembly Method
"Development Status of an OCCAM Electronic Assembly Method" by Promex CEO Richard F. Otte and Former Chief Technology Officer Dr. Edward S. Binkley. Published June 2014.Here's a downloadable version (.pdf) of the paper:[pdf-embedder...
A Simplified QFN Package Characterization Technique
"A Simplified QFN Package Characterization Technique” by Promex CEO Richard F. Otte and by Dr. Eric Bogatin and Trevor Mitchell, Bogatin Enterprises. Published August 2010. This technique was used to characterize the electrical parasitics (R, C, and L vs frequency)...