Articles & White Papers
Articles & White Papers
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Advancing Medical Devices through Heterogeneous Integration
As medical treatments continue to evolve, innovation in medical devices plays a vital role, enabling increasingly complex, precise, and safer interventions. For example: Endoscopic devices provide high-resolution in vivo imaging, Wearable sensors offer real-time...
Browse Articles & White Papers
Evolving Heterogeneous Integration Roadmap Highlights Trends
by: Annette Teng, CTO, Promex/Quik-Pak As noted in last month’s blog post, the semiconductor industry has turned its efforts toward the ongoing fleshing out of a roadmap focused on advancing heterogeneous integration (HI). HI integrates separately manufactured...
Die Attach Film Applications
"Die Attach Film Applications" By Promex CTO Annette TengPublished in MEPTEC Report Winter 2016 Die attach film (DAF) and dicing die attach film (DDAF) have been commercially available since 2000. Epoxy paste adhesives have historically been the sole epoxy material...
Advances in Medical Device Package Manufacturing
“Advances in Medical Device Package Manufacturing” by Former Promex Chief Technology Officer Dr. Edward S. Binkley. Presented at the MEPTEC Packaging Symposium, October 2014.Here's a downloadable version (.pdf) of the paper:[pdf-embedder...
Development Status of an OCCAM Electronic Assembly Method
"Development Status of an OCCAM Electronic Assembly Method" by Promex CEO Richard F. Otte and Former Chief Technology Officer Dr. Edward S. Binkley. Published June 2014.Here's a downloadable version (.pdf) of the paper:[pdf-embedder...
A Simplified QFN Package Characterization Technique
"A Simplified QFN Package Characterization Technique” by Promex CEO Richard F. Otte and by Dr. Eric Bogatin and Trevor Mitchell, Bogatin Enterprises. Published August 2010. This technique was used to characterize the electrical parasitics (R, C, and L vs frequency)...
Evolving Heterogeneous Integration Roadmap Highlights Trends
by: Annette Teng, CTO, Promex/Quik-Pak As noted in last month’s blog post, the semiconductor industry has turned its efforts toward the ongoing fleshing out of a roadmap focused on advancing heterogeneous integration (HI). HI integrates separately manufactured...
Die Attach Film Applications
"Die Attach Film Applications" By Promex CTO Annette TengPublished in MEPTEC Report Winter 2016 Die attach film (DAF) and dicing die attach film (DDAF) have been commercially available since 2000. Epoxy paste adhesives have historically been the sole epoxy material...
Advances in Medical Device Package Manufacturing
“Advances in Medical Device Package Manufacturing” by Former Promex Chief Technology Officer Dr. Edward S. Binkley. Presented at the MEPTEC Packaging Symposium, October 2014.Here's a downloadable version (.pdf) of the paper:[pdf-embedder...
Development Status of an OCCAM Electronic Assembly Method
"Development Status of an OCCAM Electronic Assembly Method" by Promex CEO Richard F. Otte and Former Chief Technology Officer Dr. Edward S. Binkley. Published June 2014.Here's a downloadable version (.pdf) of the paper:[pdf-embedder...
A Simplified QFN Package Characterization Technique
"A Simplified QFN Package Characterization Technique” by Promex CEO Richard F. Otte and by Dr. Eric Bogatin and Trevor Mitchell, Bogatin Enterprises. Published August 2010. This technique was used to characterize the electrical parasitics (R, C, and L vs frequency)...