Promex Newsroom
Promex Newsroom
Keep up with the latest company news, industry media, and press releases from Promex – a leader in sophisticated miniaturization technology.
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iMAPS Symposium 2025
Promex will be exhibiting at iMAPS Symposium 2025 in San Diego, CA, from Sept. 29 - Oct. 2, 2025. Our COO Dave Fromm will give a presentation on "Optimizing Flex Assemblies for High-Yield Manufacturing" at 9:30 a.m. on Wednesday, Oct. 1. Check out his presentation...
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iMAPS Symposium 2025
Promex will be exhibiting at iMAPS Symposium 2025 in San Diego, CA, from Sept. 29 - Oct. 2, 2025. Our COO Dave Fromm will give a presentation on "Optimizing Flex Assemblies for High-Yield Manufacturing" at 9:30 a.m. on Wednesday, Oct. 1. Check out his presentation...
Designing for Success: How Medical Device Teams Can Leverage Heterogeneous Integration
Medical device designers are at the forefront of a technological renaissance. From wearable monitors and implantable sensors to lab-on-a-chip (LoC) diagnostics, today's medical innovations are more compact, intelligent, and multifunctional than ever. However, as...
How this device broke through the blood-brain barrier
For decades, the blood-brain barrier (BBB) has been a treatment blocker in neuromedicine. But now, design engineers at Realeve and manufacturing engineers at Promex have found their way through this obstacle, which protects the brain from microorganisms circulating...
Big Changes In Medical Electronics
Medical devices are becoming more capable, more complicated, and more deployable in the field rather than in a hospital or a doctor’s office. But getting these purpose-built devices into the hands of consumers requires a whole bunch of new challenges, from...
Co-Packaged Optics Reaches Power Efficiency Tipping Point
Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at terabits per second speeds, but manufacturing challenges remain regarding fiber-to-photonic IC alignment, thermal mitigation, and optical...
Key Considerations in Designing, Developing, and Manufacturing Implantable Devices
Designing and developing implantable medical devices involves navigating complex technical challenges while ensuring the highest standards of patient safety and device performance. For companies like Injectsense, creating an implantable device that can function...
Cooling Chips Still A Top Challenge
Increasing levels of semiconductor integration means more work needs to be done in smaller spaces, which in turn generates more heat that needs to be dissipated. Managing heat dissipation in advanced node dies and in multi-die assemblies is critical to their...
Promex Industries CEO Richard Otte Honored with IEEE Electronics Manufacturing Technology Award
Award Recognizing Numerous Contributions to Be Presented at ECTC 2025 SANTA CLARA, Calif. – May 20, 2025 – Promex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced that CEO...
Promex and Realeve Recognized by MedTech Breakthrough for Best New Pain Management Solution
Realeve partnered with Promex for the development and manufacturing of its Pulsante™ Micro-Neurostimulator System SANTA CLARA, Calif. (May 8, 2025) — Promex, the leader in microelectronic component assembly, process design, and packaging of medtech and biotech...
Promex Expands Assembly Line with UV Laser & SPI Systems
Promex boosts microelectronics assembly with UV laser depaneling and 3D SPI systems, enhancing precision, yield, and speed for advanced packaging solutions.
The Engineer Behind 50 Years of Medtech Innovation
With more than 75 patents, Promex CEO Dick Otte helped shape the medical devices used today. In this Q&A with 24x7 magazine, he shares how engineering decisions have lasting effects on performance, serviceability, and the evolution of medtech. Read the full...
Can Chiplets Serve Cost-Conscious Apps?
Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity,...
iMAPS Symposium 2025
Promex will be exhibiting at iMAPS Symposium 2025 in San Diego, CA, from Sept. 29 - Oct. 2, 2025. Our COO Dave Fromm will give a presentation on "Optimizing Flex Assemblies for High-Yield Manufacturing" at 9:30 a.m. on Wednesday, Oct. 1. Check out his presentation...
Designing for Success: How Medical Device Teams Can Leverage Heterogeneous Integration
Medical device designers are at the forefront of a technological renaissance. From wearable monitors and implantable sensors to lab-on-a-chip (LoC) diagnostics, today's medical innovations are more compact, intelligent, and multifunctional than ever. However, as...
How this device broke through the blood-brain barrier
For decades, the blood-brain barrier (BBB) has been a treatment blocker in neuromedicine. But now, design engineers at Realeve and manufacturing engineers at Promex have found their way through this obstacle, which protects the brain from microorganisms circulating...
Big Changes In Medical Electronics
Medical devices are becoming more capable, more complicated, and more deployable in the field rather than in a hospital or a doctor’s office. But getting these purpose-built devices into the hands of consumers requires a whole bunch of new challenges, from...
Co-Packaged Optics Reaches Power Efficiency Tipping Point
Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at terabits per second speeds, but manufacturing challenges remain regarding fiber-to-photonic IC alignment, thermal mitigation, and optical...
Key Considerations in Designing, Developing, and Manufacturing Implantable Devices
Designing and developing implantable medical devices involves navigating complex technical challenges while ensuring the highest standards of patient safety and device performance. For companies like Injectsense, creating an implantable device that can function...
Cooling Chips Still A Top Challenge
Increasing levels of semiconductor integration means more work needs to be done in smaller spaces, which in turn generates more heat that needs to be dissipated. Managing heat dissipation in advanced node dies and in multi-die assemblies is critical to their...
Promex Industries CEO Richard Otte Honored with IEEE Electronics Manufacturing Technology Award
Award Recognizing Numerous Contributions to Be Presented at ECTC 2025 SANTA CLARA, Calif. – May 20, 2025 – Promex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced that CEO...
Promex and Realeve Recognized by MedTech Breakthrough for Best New Pain Management Solution
Realeve partnered with Promex for the development and manufacturing of its Pulsante™ Micro-Neurostimulator System SANTA CLARA, Calif. (May 8, 2025) — Promex, the leader in microelectronic component assembly, process design, and packaging of medtech and biotech...
Promex Expands Assembly Line with UV Laser & SPI Systems
Promex boosts microelectronics assembly with UV laser depaneling and 3D SPI systems, enhancing precision, yield, and speed for advanced packaging solutions.
The Engineer Behind 50 Years of Medtech Innovation
With more than 75 patents, Promex CEO Dick Otte helped shape the medical devices used today. In this Q&A with 24x7 magazine, he shares how engineering decisions have lasting effects on performance, serviceability, and the evolution of medtech. Read the full...
Can Chiplets Serve Cost-Conscious Apps?
Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity,...