Promex Newsroom
Promex Newsroom
Keep up with the latest company news, industry media, and press releases from Promex – a leader in sophisticated miniaturization technology.
Featured News
iMAPS Symposium 2025
Promex will be exhibiting at iMAPS Symposium 2025 in San Diego, CA, from Sept. 29 - Oct. 2, 2025. Our COO Dave Fromm will give a presentation on "Optimizing Flex Assemblies for High-Yield Manufacturing" at 9:30 a.m. on Wednesday, Oct. 1. Check out his presentation...
Browse News, Events, Media & Press
Promex Further Extends Die-Bonding Proficiencies
Finetech FINEPLACER® Sigma Bonder Targets Range of Application-Specific Projects State-of-the-art Finetech FINEPLACER® sigma advanced sub-micron bonder installed at Santa Clara facility SANTA CLARA, Calif., Feb. 02, 2023 (GLOBE NEWSWIRE) -- Promex Industries, a...
Unknowns And Challenges In Advanced Packaging
Dick Otte, CEO of Promex Industries, sat down with Semiconductor Engineering to talk about unknowns in material properties, the impact on bonding, and why environmental factors are so important in complex heterogeneous packages. What follows are excerpts of that...
The Path To Known Good Interconnects
Chiplets and heterogenous integration (HI) provide a compelling way to continue delivering improvements in performance, power, area, and cost (PPAC) as Moore’s Law slows, but choosing the best way to connect these devices so they behave in consistent and...
2023 Chiplet Summit
Promex will be exhibiting with Palo Alto Electron at the 2023 Chiplet Summit in San Jose, CA from January 24-26.
iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
Promex is looking forward to sponsoring the iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics.
BIOMEDevice Silicon Valley
Promex President & CEO Dick Otte will be participating in the “Biomed Device Manufacturing Panel” discussion at BIOMEDevice 2022 on Tuesday, November 29th from 12:15 - 1 p.m. at Center Stage. Additionally, Promex will be exhibiting at booth 11533 during the...
A Promex Friendsgiving Event
RSVP Here In town for the BIOMEDevice Silicon Valley Conference? Stop by Promex Industries for our Friendsgiving Event. Join us for a tour of our facility while experiencing drinks and savory tapas. We will also be holding a series of raffles that include fabulous...
Promex Expands Die Bonding Capacity, Adds New Capabilities
State-of-the-art Besi 2200 evo plus die bonder installed at Santa Clara facility SANTA CLARA, Calif., Oct. 4, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has...
MEMS & Sensors Technical Congress 2022
Promex President & CEO Dick Otte will present on "Assembly Issues That Are Unique to MEMS Devices," at the 2022 MEMS & Sensors Technical Congress as part of Session 6—Packaging Process Showdown , April 27 at 1:15pm. Learn more About the MEMS & Sensors...
MD&M West 2022
Please join us at MD&M West! APRIL 12-14, 2022 Booth 2063 Anaheim Convention Center Book Time with Me Check out the...
A Conversation About Reshoring Advanced Packaging in the U.S.
A 55-minute audio discussion with the CEO of Promex, Dick OtteThe acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors...
Promex Further Extends Die-Bonding Proficiencies
Finetech FINEPLACER® Sigma Bonder Targets Range of Application-Specific Projects State-of-the-art Finetech FINEPLACER® sigma advanced sub-micron bonder installed at Santa Clara facility SANTA CLARA, Calif., Feb. 02, 2023 (GLOBE NEWSWIRE) -- Promex Industries, a...
Unknowns And Challenges In Advanced Packaging
Dick Otte, CEO of Promex Industries, sat down with Semiconductor Engineering to talk about unknowns in material properties, the impact on bonding, and why environmental factors are so important in complex heterogeneous packages. What follows are excerpts of that...
The Path To Known Good Interconnects
Chiplets and heterogenous integration (HI) provide a compelling way to continue delivering improvements in performance, power, area, and cost (PPAC) as Moore’s Law slows, but choosing the best way to connect these devices so they behave in consistent and...
2023 Chiplet Summit
Promex will be exhibiting with Palo Alto Electron at the 2023 Chiplet Summit in San Jose, CA from January 24-26.
iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
Promex is looking forward to sponsoring the iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics.
BIOMEDevice Silicon Valley
Promex President & CEO Dick Otte will be participating in the “Biomed Device Manufacturing Panel” discussion at BIOMEDevice 2022 on Tuesday, November 29th from 12:15 - 1 p.m. at Center Stage. Additionally, Promex will be exhibiting at booth 11533 during the...
A Promex Friendsgiving Event
RSVP Here In town for the BIOMEDevice Silicon Valley Conference? Stop by Promex Industries for our Friendsgiving Event. Join us for a tour of our facility while experiencing drinks and savory tapas. We will also be holding a series of raffles that include fabulous...
Promex Expands Die Bonding Capacity, Adds New Capabilities
State-of-the-art Besi 2200 evo plus die bonder installed at Santa Clara facility SANTA CLARA, Calif., Oct. 4, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has...
MEMS & Sensors Technical Congress 2022
Promex President & CEO Dick Otte will present on "Assembly Issues That Are Unique to MEMS Devices," at the 2022 MEMS & Sensors Technical Congress as part of Session 6—Packaging Process Showdown , April 27 at 1:15pm. Learn more About the MEMS & Sensors...
MD&M West 2022
Please join us at MD&M West! APRIL 12-14, 2022 Booth 2063 Anaheim Convention Center Book Time with Me Check out the...
A Conversation About Reshoring Advanced Packaging in the U.S.
A 55-minute audio discussion with the CEO of Promex, Dick OtteThe acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors...