Promex Newsroom
Promex Newsroom
Keep up with the latest company news, industry media, and press releases from Promex – a leader in sophisticated miniaturization technology.
Featured News
iMAPS Symposium 2025
Promex will be exhibiting at iMAPS Symposium 2025 in San Diego, CA, from Sept. 29 - Oct. 2, 2025. Our COO Dave Fromm will give a presentation on "Optimizing Flex Assemblies for High-Yield Manufacturing" at 9:30 a.m. on Wednesday, Oct. 1. Check out his presentation...
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Heterogenous integration packs big innovation into small medical devices
The electronics industry began using the term heterogeneous integration (HI) about five years ago to describe a new approach to building semiconductor devices that would allow for greater density and capability. The legacy approach to making transistors, lines, and...
The Miniaturization Revolution in Electronics
In the realm of electronics and semiconductors, a silent revolution is underway, one marked not by the grandeur of size, but by the subtlety of miniaturization. This long-term trend toward smaller, more compact devices is not just a technological feat; it’s a...
Navigating Heat In Advanced Packaging
The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant issues over how to manage the thermal load. Dave Fromm, COO and vice...
Powerful Sensors for the Eye
Advances in integrated microelectronics have enabled a revolution in ever smaller and more powerful medical sensors. One such use is for detecting pressure in the eye. InjectSense has invented an implantable sensor that detects direct dynamic pressure in the eye...
Heterogeneous Integration Finding Its Footing
Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management...
Wirebonding Is Here To Stay
Few technologies in semiconductor manufacturing have stood the test of time as steadfastly as wirebonding. This process, which involves electrically connecting semiconductor devices to their packages, has been a cornerstone of the electronics industry since the...
Navigating thermally induced dynamics when developing miniaturized medical devices
Some complexities of integrating miniaturized components, such as microelectronics, into increasingly small medical devices are obvious. Examples include the precision required to position and align components with the requisite accuracy, or the...
Building Better Bridges In Advanced Packaging
The increasing challenges and rising cost of logic scaling, along with demands for an increasing number of features, are pushing more companies into advanced packaging. And while that opens up a slew of new options, it also is causing widespread confusion over what...
How to Build Better Medical Microelectronics
Advances in semiconductors, materials, power, and more are enabling electronics to miniaturize—including medical electronics. Design News asked Dave Fromm, Promex’s chief operating officer, a few questions about engineering microelectronics for medical devices....
Right Sizing Implantable Pressure Sensors
More uses for implantable sensors are being discovered every day. One such capability is pressure detection, including the detection of intra-ocular pressure, helpful for treating glaucoma. In this article for Medical Device & Diagnostic Industry, Promex's Dave...
Exploring the Intricacies of IC Packaging and Assembly Services
Dick Otte, CEO, and Rosie Medina, Vice President, Sales and Marketing, both at QP Technologies, discuss how the company helps its customers with a range of semiconductor technology solutions, covering wafer preparation, advanced assembly and design, IC packaging...
Promex Names David Fromm Chief Operating Officer
SANTA CLARA, Calif. (August 10, 2023) -- Promex, a leader in the assembly of physically small devices that contain semiconductor chips for the medical, biotechnology and communications markets, announced it has named David Fromm its chief operating officer. The...
Heterogenous integration packs big innovation into small medical devices
The electronics industry began using the term heterogeneous integration (HI) about five years ago to describe a new approach to building semiconductor devices that would allow for greater density and capability. The legacy approach to making transistors, lines, and...
The Miniaturization Revolution in Electronics
In the realm of electronics and semiconductors, a silent revolution is underway, one marked not by the grandeur of size, but by the subtlety of miniaturization. This long-term trend toward smaller, more compact devices is not just a technological feat; it’s a...
Navigating Heat In Advanced Packaging
The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant issues over how to manage the thermal load. Dave Fromm, COO and vice...
Powerful Sensors for the Eye
Advances in integrated microelectronics have enabled a revolution in ever smaller and more powerful medical sensors. One such use is for detecting pressure in the eye. InjectSense has invented an implantable sensor that detects direct dynamic pressure in the eye...
Heterogeneous Integration Finding Its Footing
Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management...
Wirebonding Is Here To Stay
Few technologies in semiconductor manufacturing have stood the test of time as steadfastly as wirebonding. This process, which involves electrically connecting semiconductor devices to their packages, has been a cornerstone of the electronics industry since the...
Navigating thermally induced dynamics when developing miniaturized medical devices
Some complexities of integrating miniaturized components, such as microelectronics, into increasingly small medical devices are obvious. Examples include the precision required to position and align components with the requisite accuracy, or the...
Building Better Bridges In Advanced Packaging
The increasing challenges and rising cost of logic scaling, along with demands for an increasing number of features, are pushing more companies into advanced packaging. And while that opens up a slew of new options, it also is causing widespread confusion over what...
How to Build Better Medical Microelectronics
Advances in semiconductors, materials, power, and more are enabling electronics to miniaturize—including medical electronics. Design News asked Dave Fromm, Promex’s chief operating officer, a few questions about engineering microelectronics for medical devices....
Right Sizing Implantable Pressure Sensors
More uses for implantable sensors are being discovered every day. One such capability is pressure detection, including the detection of intra-ocular pressure, helpful for treating glaucoma. In this article for Medical Device & Diagnostic Industry, Promex's Dave...
Exploring the Intricacies of IC Packaging and Assembly Services
Dick Otte, CEO, and Rosie Medina, Vice President, Sales and Marketing, both at QP Technologies, discuss how the company helps its customers with a range of semiconductor technology solutions, covering wafer preparation, advanced assembly and design, IC packaging...
Promex Names David Fromm Chief Operating Officer
SANTA CLARA, Calif. (August 10, 2023) -- Promex, a leader in the assembly of physically small devices that contain semiconductor chips for the medical, biotechnology and communications markets, announced it has named David Fromm its chief operating officer. The...