Disruptions to the global semiconductor supply chain caused by the COVID-19 pandemic had a severe impact in nearly every sector of the worldwide economy, and especially the worldwide semiconductor market. In this Semiconductor Engineering article, Dave Fromm, head...

Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field. Promex CEO Dick Otte shared his thoughts on the challenges and...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of challenges that will take years to fully resolve. Dave Fromm, COO at...

The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various technologies and device nodes can be integrated in a single package...

With a unique factory setting featuring cutting-edge equipment and meticulous supply chain management, Promex partners with med and biotech companies at all stages in the assembly process, from early prototypes to R&D development and high-volume production....

Circuit scaling is starting to hit a wall as the laws of physics clash with exponential increases in the volume of data, forcing chipmakers to take a much closer look at silicon photonics as a way of moving data from where it is collected to where it is processed...

Medical device designers’ goals have always been enhancing and enriching device functionality while reducing size and cost. This is particularly true as modern devices start acting like complex miniaturized computers for the body, interfaced with microelectronic...

The electronics industry began using the term heterogeneous integration (HI) about five years ago to describe a new approach to building semiconductor devices that would allow for greater density and capability. The legacy approach to making transistors, lines, and...

In the realm of electronics and semiconductors, a silent revolution is underway, one marked not by the grandeur of size, but by the subtlety of miniaturization. This long-term trend toward smaller, more compact devices is not just a technological feat; it’s a...

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant issues over how to manage the thermal load. Dave Fromm, COO and vice...

Advances in integrated microelectronics have enabled a revolution in ever smaller and more powerful medical sensors. One such use is for detecting pressure in the eye. InjectSense has invented an implantable sensor that detects direct dynamic pressure in the eye...

Disruptions to the global semiconductor supply chain caused by the COVID-19 pandemic had a severe impact in nearly every sector of the worldwide economy, and especially the worldwide semiconductor market. In this Semiconductor Engineering article, Dave Fromm, head...

Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field. Promex CEO Dick Otte shared his thoughts on the challenges and...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of challenges that will take years to fully resolve. Dave Fromm, COO at...

The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various technologies and device nodes can be integrated in a single package...

With a unique factory setting featuring cutting-edge equipment and meticulous supply chain management, Promex partners with med and biotech companies at all stages in the assembly process, from early prototypes to R&D development and high-volume production....

Circuit scaling is starting to hit a wall as the laws of physics clash with exponential increases in the volume of data, forcing chipmakers to take a much closer look at silicon photonics as a way of moving data from where it is collected to where it is processed...

Medical device designers’ goals have always been enhancing and enriching device functionality while reducing size and cost. This is particularly true as modern devices start acting like complex miniaturized computers for the body, interfaced with microelectronic...

The electronics industry began using the term heterogeneous integration (HI) about five years ago to describe a new approach to building semiconductor devices that would allow for greater density and capability. The legacy approach to making transistors, lines, and...

In the realm of electronics and semiconductors, a silent revolution is underway, one marked not by the grandeur of size, but by the subtlety of miniaturization. This long-term trend toward smaller, more compact devices is not just a technological feat; it’s a...

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant issues over how to manage the thermal load. Dave Fromm, COO and vice...

Advances in integrated microelectronics have enabled a revolution in ever smaller and more powerful medical sensors. One such use is for detecting pressure in the eye. InjectSense has invented an implantable sensor that detects direct dynamic pressure in the eye...