Fan-Out Panel-Level Packaging (FOPLP) for advanced nodes, once hindered by manufacturability and yield challenges, is emerging as a promising solution to meet the industry’s demands for higher integration densities and cost efficiency. However, the technology still...

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is accelerating, making it harder for the entire ecosystem to keep up with...

In this ‘Wine Down Friday’ interview for Power Electronics News, Promex CEO Dick Otte reflects on his over 60 years of expertise in industrial solutions, sharing insights into his career development, leadership style, business challenges, and how Promex is adapting...

Establishing a quality management system (QMS) that is both effective and efficient is a challenging but essential part of ensuring quality in your operations. Whether your organization is seeking compliance with standards like ISO 13485 or ISO 9001, or simply...

Decoupling capacitors have long been an important aspect of maintaining a clean power source for integrated circuits, but with noise caused by rising clock frequencies, multiple power domains, and various types of advanced packaging, new approaches are needed. In...

The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and extraordinarily complex problems. At the heart of this change is the...

As chips are disaggregated into chiplets, more features are being added into these devices that chipmakers were unable to include in the past due to reticle size limits and the high cost of scaling everything to the latest process node. This has opened the door to...

Dick Otte, CEO of Promex Industries and QP Technologies, sat down with Semiecosystem to discuss traditional chip scaling, chiplets, mature package types, and reshoring, as well as the issues in packaging for medical devices and compound semiconductors. Read the...

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. In this Semiconductor Engineering article, Dick Otte, CEO of Promex,...

Medical devices are getting smaller, smarter, and more powerful – much like the evolution of computers. In fact, many of today’s microelectronic-containing medical devices act very much like minicomputers -- sensing, seeing, gathering and sharing data, from both...

Fan-Out Panel-Level Packaging (FOPLP) for advanced nodes, once hindered by manufacturability and yield challenges, is emerging as a promising solution to meet the industry’s demands for higher integration densities and cost efficiency. However, the technology still...

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is accelerating, making it harder for the entire ecosystem to keep up with...

In this ‘Wine Down Friday’ interview for Power Electronics News, Promex CEO Dick Otte reflects on his over 60 years of expertise in industrial solutions, sharing insights into his career development, leadership style, business challenges, and how Promex is adapting...

Establishing a quality management system (QMS) that is both effective and efficient is a challenging but essential part of ensuring quality in your operations. Whether your organization is seeking compliance with standards like ISO 13485 or ISO 9001, or simply...

Decoupling capacitors have long been an important aspect of maintaining a clean power source for integrated circuits, but with noise caused by rising clock frequencies, multiple power domains, and various types of advanced packaging, new approaches are needed. In...

The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and extraordinarily complex problems. At the heart of this change is the...

As chips are disaggregated into chiplets, more features are being added into these devices that chipmakers were unable to include in the past due to reticle size limits and the high cost of scaling everything to the latest process node. This has opened the door to...

Dick Otte, CEO of Promex Industries and QP Technologies, sat down with Semiecosystem to discuss traditional chip scaling, chiplets, mature package types, and reshoring, as well as the issues in packaging for medical devices and compound semiconductors. Read the...

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. In this Semiconductor Engineering article, Dick Otte, CEO of Promex,...

Medical devices are getting smaller, smarter, and more powerful – much like the evolution of computers. In fact, many of today’s microelectronic-containing medical devices act very much like minicomputers -- sensing, seeing, gathering and sharing data, from both...