Promex Newsroom
Promex Newsroom
Keep up with the latest company news, industry media, and press releases from Promex – a leader in sophisticated miniaturization technology.
Featured News
Promex and Realeve Recognized by MedTech Breakthrough for Best New Pain Management Solution
Realeve partnered with Promex for the development and manufacturing of its Pulsante™ Micro-Neurostimulator System SANTA CLARA, Calif. (May 8, 2025) — Promex, the leader in microelectronic component assembly, process design, and packaging of medtech and biotech...
Browse News, Events, Media & Press
Linear Pluggable Optics Save Energy In Data Centers
Linear pluggable optics (LPO) is garnering more attention as a way to quickly and efficiently move data in and out of server racks, but a lack of standards for connecting the optical modules is slowing adoption at a time when there is growing pressure to reduce...
What’s Next In Advanced Packaging?
Semiconductor Engineering sat down with advanced packaging experts to discuss 3D-IC progress and issues, photonics, and tradeoffs with different interposers and bridge technologies; featuring: Michael Kelly, vice president of Chiplets and FCBGA Integration at...
Benefits and Challenges of Sensors that Utilize Chips and MEMS
Semiconductor chips, including microelectromechanical systems (MEMS), have revolutionized sensors in recent times. The inclusion in sensors of these miniature semiconductor and mechanical devices enables detection, analysis, communication and physical motion...
Advanced Packaging Moving At Breakneck Pace
Semiconductor Engineering sat down to discuss advances in packaging with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director...
Electrifying Everything: Power Moves Toward ICs
As electronic systems grow increasingly complex and energy-intensive, traditional power management methods — centered on centralized systems and external components — are proving inadequate. More data needs to be processed in less time with more and often smaller...
Sensors Converge 2025
Promex will be exhibiting at Sensors Converge 2025 at Santa Clara Convention Center in booth #909.
iMAPS Advanced Packaging for Medical Microelectronics Workshop
Promex will be presenting at the Advanced Packaging for Medical Microelectronics Workshop, co-located with the iMAPS Device Packaging Conference 2025 at Sheraton at Wild Horse Pass.
iMAPS DPC 2025
Promex will be exhibiting at iMAPS Device Packaging Conference 2025 at Sheraton at Wild Horse Pass in booth #307
MD&M West 2025
Promex will be exhibiting at MD&M West 2025 at the Anaheim Convention Center in booth #2393.
Chiplet Summit 2025
Promex will be exhibiting at Chiplet Summit 2025 in Santa Clara, CA from January 21-23, 2025. Stop by booth 410 and learn how our assembly and packaging services can bring your microelectronics projects from concept to production, or contact Rosie Media at...
2025 Viewpoint: The Future of Flex Is Here
Each year, Semiconductor Digest turns to industry leaders and analysts to get their viewpoints on what they expect to see in the coming year in terms of critical tech and business trends. Promex COO Dave Fromm provided his insights on the growing demand for complex...
Navigating Increased Complexity In Advanced Packaging
As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it means to achieve precision, forcing companies to rethink...
Linear Pluggable Optics Save Energy In Data Centers
Linear pluggable optics (LPO) is garnering more attention as a way to quickly and efficiently move data in and out of server racks, but a lack of standards for connecting the optical modules is slowing adoption at a time when there is growing pressure to reduce...
What’s Next In Advanced Packaging?
Semiconductor Engineering sat down with advanced packaging experts to discuss 3D-IC progress and issues, photonics, and tradeoffs with different interposers and bridge technologies; featuring: Michael Kelly, vice president of Chiplets and FCBGA Integration at...
Benefits and Challenges of Sensors that Utilize Chips and MEMS
Semiconductor chips, including microelectromechanical systems (MEMS), have revolutionized sensors in recent times. The inclusion in sensors of these miniature semiconductor and mechanical devices enables detection, analysis, communication and physical motion...
Advanced Packaging Moving At Breakneck Pace
Semiconductor Engineering sat down to discuss advances in packaging with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director...
Electrifying Everything: Power Moves Toward ICs
As electronic systems grow increasingly complex and energy-intensive, traditional power management methods — centered on centralized systems and external components — are proving inadequate. More data needs to be processed in less time with more and often smaller...
Sensors Converge 2025
Promex will be exhibiting at Sensors Converge 2025 at Santa Clara Convention Center in booth #909.
iMAPS Advanced Packaging for Medical Microelectronics Workshop
Promex will be presenting at the Advanced Packaging for Medical Microelectronics Workshop, co-located with the iMAPS Device Packaging Conference 2025 at Sheraton at Wild Horse Pass.
iMAPS DPC 2025
Promex will be exhibiting at iMAPS Device Packaging Conference 2025 at Sheraton at Wild Horse Pass in booth #307
MD&M West 2025
Promex will be exhibiting at MD&M West 2025 at the Anaheim Convention Center in booth #2393.
Chiplet Summit 2025
Promex will be exhibiting at Chiplet Summit 2025 in Santa Clara, CA from January 21-23, 2025. Stop by booth 410 and learn how our assembly and packaging services can bring your microelectronics projects from concept to production, or contact Rosie Media at...
2025 Viewpoint: The Future of Flex Is Here
Each year, Semiconductor Digest turns to industry leaders and analysts to get their viewpoints on what they expect to see in the coming year in terms of critical tech and business trends. Promex COO Dave Fromm provided his insights on the growing demand for complex...
Navigating Increased Complexity In Advanced Packaging
As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it means to achieve precision, forcing companies to rethink...