Our innovative technology will move your proof-of-concept to finished product faster. If it’s a Class III device you’re developing, we can help you with FDA 510(k) clearance to accelerate time to market. Over half of our business involves medical devices and biosensors-equipped microelectronic devices. With this kind of experience at your disposal, you know your project is in capable hands.

Here are just a few examples of life-changing biotech applications

  • Around 40 million people worldwide are infected with HIV, yet 90% have never been tested for the disease. Lab-On-a-Chip (LOC) devices with miniaturized laboratory functions enable healthcare providers in poorly equipped clinics to perform diagnostic tests. Working with LOCs requires expertise with materials (silicon, glass and polymers) microfluidics (fluid flow in sub-millimeter-diameter channels), optical and electrochemical sensors and MEMS devices. We have all that, and more.
  • For the estimated 380 million people with diabetes, monitoring glucose levels can be cumbersome and painful. Small adhesive patches containing miniaturized glucose monitors will not only enable less disruptive continuous subcutaneous monitoring of interstitial fluid, but also provide wireless connectivity for secure data sharing.
  • Soft contact lenses containing miniature ICs, sensors, and wireless communication capabilities require engineering novel solutions to numerous technical challenges, including significant miniaturization for autonomous sensing systems and dramatic reduction of power consumption to accommodate tiny batteries.

Engineering, processes, and heterogeneous assembly make the impossible possible

  • Custom design of diagnostic chips and sensors requiring special processing
  • Controlled, high accuracy dispensing of biocompatible organics for sealing and fluid flow control (adhesives, sealants, die attach materials and encapsulants) in SIPs and mechanical interfaces
  • Sterilization, plasma/wet bench cleaning and cleaning using water-soluble fluxes to minimize residue
  • Assembly of optical elements with thermally cured and UV adhesives, parts molded in polymers, machined parts and fluid-control channels
  • Packaging ICs for shipment, including sealing in final container in Class 100 and Class 1000 cleanrooms