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Articles, News & Press Releases from Promex.
A fully integrated cGMP manufacturer of FDA compliant Class II / III medical device and biotech assemblies located in the heart of Silicon Valley.
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White Paper: Advanced Packaging for Medical Microelectronics
Sensors and microelectromechanical systems (MEMS) are enabling more complex designs of miniature devices in healthcare, smart systems, and consumer electronics. To navigate the challenge of building these devices, it’s essential to partner with an expert in...
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Enabling New Functionality in Medtech and Biotech Devices
By Dick Otte, CEO, Promex Industries Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these...
U.S. Focuses on Invigorating ‘Chiplets’ to Stay Cutting-Edge in Tech
Chiplets, a way to design chips for higher performance, has become a key prong of U.S. industrial policy. But pushing for more of this activity domestically is challenging. Dick Otte, CEO of Promex Industries, shared his insights into this challenge with The New...
3D Structures Challenge Wire Bond Inspection
Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers. Jeff Schaefer, senior process engineer of Promex Industries, shared insights into this challenge in this Semiconductor...
Promex Bolsters Leadership Team with David Fromm as Vice President of Engineering
Fromm's addition greatly enhances microelectronic component assembly capabilities for medtech and biotech markets. SANTA CLARA, Calif., April 19, 2023 – Promex Industries, a Silicon Valley-based provider of advanced microelectronic component assembly and design...
Big Changes Ahead In Power Delivery, Materials, And Interconnects
When it comes to device interconnects, it’s hard to beat copper. Its low resistivity and high reliability have served the industry exceedingly well as both on-chip interconnect and wires between chips. But in logic chips, with interconnect stacks rising into the...
Mini-Consortia Forming Around Chiplets
Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows and fueled by combinations of hardened IP that have been proven in silicon. Dick Otte, CEO of Promex Industries, shared his...
Managing Thermal-Induced Stress In Chips
Heterogeneous integration and increasing density at advanced nodes are creating some complex and difficult challenges for IC manufacturing and packaging. Chip Greely, vice president of engineering at Promex, offered insights into this issue to Semiconductor...
Bump Reliability is Challenged By Latent Defects
Thermal stress is a well-known problem in advanced packaging, along with the challenges of mechanical stress. Both are exacerbated by heterogenous integration, which often requires mingling materials with incompatible coefficients of thermal expansion (CTE). Chip...
Promex Further Extends Die-Bonding Proficiencies
Finetech FINEPLACER® Sigma Bonder Targets Range of Application-Specific Projects State-of-the-art Finetech FINEPLACER® sigma advanced sub-micron bonder installed at Santa Clara facility SANTA CLARA, Calif., Feb. 02, 2023 (GLOBE NEWSWIRE) -- Promex Industries, a...
Unknowns And Challenges In Advanced Packaging
Dick Otte, CEO of Promex Industries, sat down with Semiconductor Engineering to talk about unknowns in material properties, the impact on bonding, and why environmental factors are so important in complex heterogeneous packages. What follows are excerpts of that...
The Path To Known Good Interconnects
Chiplets and heterogenous integration (HI) provide a compelling way to continue delivering improvements in performance, power, area, and cost (PPAC) as Moore’s Law slows, but choosing the best way to connect these devices so they behave in consistent and...
2023 Chiplet Summit
Promex will be exhibiting with Palo Alto Electron at the 2023 Chiplet Summit in San Jose, CA from January 24-26.
iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
Promex is looking forward to sponsoring the iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics.
Webinar: Heterogeneous Integration Manufacturing
Promex Enables New Functionality in MedTech Devices Combining technologies and components with electronics requires improved design methods, software, more material properties, longer supply chains and a sophisticated manufacturing process known as heterogeneous...
BIOMEDevice Silicon Valley
Promex President & CEO Dick Otte will be participating in the “Biomed Device Manufacturing Panel” discussion at BIOMEDevice 2022 on Tuesday, November 29th from 12:15 - 1 p.m. at Center Stage. Additionally, Promex will be exhibiting at booth 11533 during the...
A Promex Friendsgiving Event
RSVP Here In town for the BIOMEDevice Silicon Valley Conference? Stop by Promex Industries for our Friendsgiving Event. Join us for a tour of our facility while experiencing drinks and savory tapas. We will also be holding a series of raffles that include fabulous...
Promex Expands Die Bonding Capacity, Adds New Capabilities
State-of-the-art Besi 2200 evo plus die bonder installed at Santa Clara facility SANTA CLARA, Calif., Oct. 4, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has...
Heterogeneous Chip Assembly Helps Optimize Medical and Wearable Devices
Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the processes associated with assembling these classes of devices.
Heterogeneous Integration Device Assembly: Key to Enabling Additional Innovations
In Part 1 of this series, we explored the history of medical innovations and how new approaches, like heterogeneous integration (HI), are poised to enable groundbreaking new treatments. Here, we will expand on the role of HI, as well as the assembly challenges for these devices and the importance of working with the right partner to successfully bring new medical devices to market.
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