The chip industry is stepping up efforts to be seen as environmentally friendly, driven by growing pressure from customers and government regulations. In this Semiconductor Engineering article, Dick Otte, CEO of Promex, discussed how the company is working towards...

Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these markets present a variety of...

New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. Jeff Schaefer, senior process engineer at Promex Industries, shared insights into...

Chiplets, a way to design chips for higher performance, has become a key prong of U.S. industrial policy. But pushing for more of this activity domestically is challenging. Dick Otte, CEO of Promex Industries, shared his insights into this challenge with The New...

Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers. Jeff Schaefer, senior process engineer of Promex Industries, shared insights into this challenge in this Semiconductor...

When it comes to device interconnects, it’s hard to beat copper. Its low resistivity and high reliability have served the industry exceedingly well as both on-chip interconnect and wires between chips. But in logic chips, with interconnect stacks rising into the...

Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows and fueled by combinations of hardened IP that have been proven in silicon. Dick Otte, CEO of Promex Industries, shared his...

Heterogeneous integration and increasing density at advanced nodes are creating some complex and difficult challenges for IC manufacturing and packaging. Chip Greely, vice president of engineering at Promex, offered insights into this issue to Semiconductor...

Thermal stress is a well-known problem in advanced packaging, along with the challenges of mechanical stress. Both are exacerbated by heterogenous integration, which often requires mingling materials with incompatible coefficients of thermal expansion (CTE). Chip...

The chip industry is stepping up efforts to be seen as environmentally friendly, driven by growing pressure from customers and government regulations. In this Semiconductor Engineering article, Dick Otte, CEO of Promex, discussed how the company is working towards...

Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these markets present a variety of...

New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. Jeff Schaefer, senior process engineer at Promex Industries, shared insights into...

Chiplets, a way to design chips for higher performance, has become a key prong of U.S. industrial policy. But pushing for more of this activity domestically is challenging. Dick Otte, CEO of Promex Industries, shared his insights into this challenge with The New...

Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers. Jeff Schaefer, senior process engineer of Promex Industries, shared insights into this challenge in this Semiconductor...

When it comes to device interconnects, it’s hard to beat copper. Its low resistivity and high reliability have served the industry exceedingly well as both on-chip interconnect and wires between chips. But in logic chips, with interconnect stacks rising into the...

Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows and fueled by combinations of hardened IP that have been proven in silicon. Dick Otte, CEO of Promex Industries, shared his...

Heterogeneous integration and increasing density at advanced nodes are creating some complex and difficult challenges for IC manufacturing and packaging. Chip Greely, vice president of engineering at Promex, offered insights into this issue to Semiconductor...

Thermal stress is a well-known problem in advanced packaging, along with the challenges of mechanical stress. Both are exacerbated by heterogenous integration, which often requires mingling materials with incompatible coefficients of thermal expansion (CTE). Chip...