Promex Newsroom
Promex Newsroom
Keep up with the latest company news, industry media, and press releases from Promex – a leader in sophisticated miniaturization technology.
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Promex Industries and QP Technologies Appoint Jeannine Serbanich as Vice President of Finance
Experienced Financial Executive to Streamline Companies’ Financial Processes, Partnering with Leadership Team to Drive Improved Performance ESCONDIDO, Calif. – December 4, 2024 – Microelectronics and packaging assembly leaders Promex Industries, Inc., and its QP...
Browse News, Events, Media & Press
Mini-Consortia Forming Around Chiplets
Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows and fueled by combinations of hardened IP that have been proven in silicon. Dick Otte, CEO of Promex Industries, shared his...
Managing Thermal-Induced Stress In Chips
Heterogeneous integration and increasing density at advanced nodes are creating some complex and difficult challenges for IC manufacturing and packaging. Chip Greely, vice president of engineering at Promex, offered insights into this issue to Semiconductor...
Bump Reliability is Challenged By Latent Defects
Thermal stress is a well-known problem in advanced packaging, along with the challenges of mechanical stress. Both are exacerbated by heterogenous integration, which often requires mingling materials with incompatible coefficients of thermal expansion (CTE). Chip...
Promex Further Extends Die-Bonding Proficiencies
Finetech FINEPLACER® Sigma Bonder Targets Range of Application-Specific Projects State-of-the-art Finetech FINEPLACER® sigma advanced sub-micron bonder installed at Santa Clara facility SANTA CLARA, Calif., Feb. 02, 2023 (GLOBE NEWSWIRE) -- Promex Industries, a...
Unknowns And Challenges In Advanced Packaging
Dick Otte, CEO of Promex Industries, sat down with Semiconductor Engineering to talk about unknowns in material properties, the impact on bonding, and why environmental factors are so important in complex heterogeneous packages. What follows are excerpts of that...
The Path To Known Good Interconnects
Chiplets and heterogenous integration (HI) provide a compelling way to continue delivering improvements in performance, power, area, and cost (PPAC) as Moore’s Law slows, but choosing the best way to connect these devices so they behave in consistent and...
2023 Chiplet Summit
Promex will be exhibiting with Palo Alto Electron at the 2023 Chiplet Summit in San Jose, CA from January 24-26.
iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
Promex is looking forward to sponsoring the iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics.
BIOMEDevice Silicon Valley
Promex President & CEO Dick Otte will be participating in the “Biomed Device Manufacturing Panel” discussion at BIOMEDevice 2022 on Tuesday, November 29th from 12:15 - 1 p.m. at Center Stage. Additionally, Promex will be exhibiting at booth 11533 during the...
A Promex Friendsgiving Event
RSVP Here In town for the BIOMEDevice Silicon Valley Conference? Stop by Promex Industries for our Friendsgiving Event. Join us for a tour of our facility while experiencing drinks and savory tapas. We will also be holding a series of raffles that include fabulous...
Promex Expands Die Bonding Capacity, Adds New Capabilities
State-of-the-art Besi 2200 evo plus die bonder installed at Santa Clara facility SANTA CLARA, Calif., Oct. 4, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has...
Mini-Consortia Forming Around Chiplets
Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows and fueled by combinations of hardened IP that have been proven in silicon. Dick Otte, CEO of Promex Industries, shared his...
Managing Thermal-Induced Stress In Chips
Heterogeneous integration and increasing density at advanced nodes are creating some complex and difficult challenges for IC manufacturing and packaging. Chip Greely, vice president of engineering at Promex, offered insights into this issue to Semiconductor...
Bump Reliability is Challenged By Latent Defects
Thermal stress is a well-known problem in advanced packaging, along with the challenges of mechanical stress. Both are exacerbated by heterogenous integration, which often requires mingling materials with incompatible coefficients of thermal expansion (CTE). Chip...
Promex Further Extends Die-Bonding Proficiencies
Finetech FINEPLACER® Sigma Bonder Targets Range of Application-Specific Projects State-of-the-art Finetech FINEPLACER® sigma advanced sub-micron bonder installed at Santa Clara facility SANTA CLARA, Calif., Feb. 02, 2023 (GLOBE NEWSWIRE) -- Promex Industries, a...
Unknowns And Challenges In Advanced Packaging
Dick Otte, CEO of Promex Industries, sat down with Semiconductor Engineering to talk about unknowns in material properties, the impact on bonding, and why environmental factors are so important in complex heterogeneous packages. What follows are excerpts of that...
The Path To Known Good Interconnects
Chiplets and heterogenous integration (HI) provide a compelling way to continue delivering improvements in performance, power, area, and cost (PPAC) as Moore’s Law slows, but choosing the best way to connect these devices so they behave in consistent and...
2023 Chiplet Summit
Promex will be exhibiting with Palo Alto Electron at the 2023 Chiplet Summit in San Jose, CA from January 24-26.
iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
Promex is looking forward to sponsoring the iMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics.
BIOMEDevice Silicon Valley
Promex President & CEO Dick Otte will be participating in the “Biomed Device Manufacturing Panel” discussion at BIOMEDevice 2022 on Tuesday, November 29th from 12:15 - 1 p.m. at Center Stage. Additionally, Promex will be exhibiting at booth 11533 during the...
A Promex Friendsgiving Event
RSVP Here In town for the BIOMEDevice Silicon Valley Conference? Stop by Promex Industries for our Friendsgiving Event. Join us for a tour of our facility while experiencing drinks and savory tapas. We will also be holding a series of raffles that include fabulous...
Promex Expands Die Bonding Capacity, Adds New Capabilities
State-of-the-art Besi 2200 evo plus die bonder installed at Santa Clara facility SANTA CLARA, Calif., Oct. 4, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has...