Sensor packaging, particularly for microelectromechanical systems (MEMS), is a critical aspect of modern electronics. MEMS developers have demonstrated a variety of innovative microsensors for almost every possible sensing modality including temperature, pressure,...

The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies that can reduce costs and speed time to market. Promex CEO Dick...

Disruptions to the global semiconductor supply chain caused by the COVID-19 pandemic had a severe impact in nearly every sector of the worldwide economy, and especially the worldwide semiconductor market. In this Semiconductor Engineering article, Dave Fromm, head...

Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field. Promex CEO Dick Otte shared his thoughts on the challenges and...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of challenges that will take years to fully resolve. Dave Fromm, COO at...

The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various technologies and device nodes can be integrated in a single package...

With a unique factory setting featuring cutting-edge equipment and meticulous supply chain management, Promex partners with med and biotech companies at all stages in the assembly process, from early prototypes to R&D development and high-volume production....

Circuit scaling is starting to hit a wall as the laws of physics clash with exponential increases in the volume of data, forcing chipmakers to take a much closer look at silicon photonics as a way of moving data from where it is collected to where it is processed...

Medical device designers’ goals have always been enhancing and enriching device functionality while reducing size and cost. This is particularly true as modern devices start acting like complex miniaturized computers for the body, interfaced with microelectronic...

Sensor packaging, particularly for microelectromechanical systems (MEMS), is a critical aspect of modern electronics. MEMS developers have demonstrated a variety of innovative microsensors for almost every possible sensing modality including temperature, pressure,...

The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies that can reduce costs and speed time to market. Promex CEO Dick...

Disruptions to the global semiconductor supply chain caused by the COVID-19 pandemic had a severe impact in nearly every sector of the worldwide economy, and especially the worldwide semiconductor market. In this Semiconductor Engineering article, Dave Fromm, head...

Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field. Promex CEO Dick Otte shared his thoughts on the challenges and...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of challenges that will take years to fully resolve. Dave Fromm, COO at...

The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various technologies and device nodes can be integrated in a single package...

With a unique factory setting featuring cutting-edge equipment and meticulous supply chain management, Promex partners with med and biotech companies at all stages in the assembly process, from early prototypes to R&D development and high-volume production....

Circuit scaling is starting to hit a wall as the laws of physics clash with exponential increases in the volume of data, forcing chipmakers to take a much closer look at silicon photonics as a way of moving data from where it is collected to where it is processed...

Medical device designers’ goals have always been enhancing and enriching device functionality while reducing size and cost. This is particularly true as modern devices start acting like complex miniaturized computers for the body, interfaced with microelectronic...