When it comes to device interconnects, it’s hard to beat copper. Its low resistivity and high reliability have served the industry exceedingly well as both on-chip interconnect and wires between chips. But in logic chips, with interconnect stacks rising into the...

Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows and fueled by combinations of hardened IP that have been proven in silicon. Dick Otte, CEO of Promex Industries, shared his...

Heterogeneous integration and increasing density at advanced nodes are creating some complex and difficult challenges for IC manufacturing and packaging. Chip Greely, vice president of engineering at Promex, offered insights into this issue to Semiconductor...

Thermal stress is a well-known problem in advanced packaging, along with the challenges of mechanical stress. Both are exacerbated by heterogenous integration, which often requires mingling materials with incompatible coefficients of thermal expansion (CTE). Chip...

Dick Otte, CEO of Promex Industries, sat down with Semiconductor Engineering to talk about unknowns in material properties, the impact on bonding, and why environmental factors are so important in complex heterogeneous packages. What follows are excerpts of that...

Chiplets and heterogenous integration (HI) provide a compelling way to continue delivering improvements in performance, power, area, and cost (PPAC) as Moore’s Law slows, but choosing the best way to connect these devices so they behave in consistent and...

When it comes to device interconnects, it’s hard to beat copper. Its low resistivity and high reliability have served the industry exceedingly well as both on-chip interconnect and wires between chips. But in logic chips, with interconnect stacks rising into the...

Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows and fueled by combinations of hardened IP that have been proven in silicon. Dick Otte, CEO of Promex Industries, shared his...

Heterogeneous integration and increasing density at advanced nodes are creating some complex and difficult challenges for IC manufacturing and packaging. Chip Greely, vice president of engineering at Promex, offered insights into this issue to Semiconductor...

Thermal stress is a well-known problem in advanced packaging, along with the challenges of mechanical stress. Both are exacerbated by heterogenous integration, which often requires mingling materials with incompatible coefficients of thermal expansion (CTE). Chip...

Dick Otte, CEO of Promex Industries, sat down with Semiconductor Engineering to talk about unknowns in material properties, the impact on bonding, and why environmental factors are so important in complex heterogeneous packages. What follows are excerpts of that...

Chiplets and heterogenous integration (HI) provide a compelling way to continue delivering improvements in performance, power, area, and cost (PPAC) as Moore’s Law slows, but choosing the best way to connect these devices so they behave in consistent and...