To get your complex devices to market faster, you need an engineering advantage. We’ll use our years of engineering experience and materials science expertise to provide you with a seamless transition from engineering to production.
Backgrinding and sawing of wafers up to 12 inches. Custom thinning. Working with AlN, glass and ceramic. Applying die attach film prior to sawing. “Pizza” wafers. Shuttle die processing. Waffle packing. Tell us what you need. We’ll get it done.
Unique assemblies – especially those like SiPs that must provide not only electronic, but other functionality as well – require unconventional processes. If this is your challenge, we’ll find an innovative solution.
Looking for packaging for one-of-a-kind applications? Need a super quick turn? Or maybe you’re ready for onshore volume production. Count on us for package design, simulation and characterization. Along with supply chain management and turnkey procurement. For every packaging project, Promex and Quik-Pak deliver.
Quality starts with good documentation and processes. Compliance comes from being ISO 13485:2016 / ISO 9001:2015 certified, ITAR registered, and IPC-A-610 Class 3 trained. Because first you have to know the rules before you can follow them, right?