Promex Newsroom
Promex Newsroom
Keep up with the latest company news, industry media, and press releases from Promex – a leader in sophisticated miniaturization technology.
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Promex Expands Assembly Line with UV Laser & SPI Systems
Promex boosts microelectronics assembly with UV laser depaneling and 3D SPI systems, enhancing precision, yield, and speed for advanced packaging solutions.
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Promex Expands Assembly Line with UV Laser & SPI Systems
Promex boosts microelectronics assembly with UV laser depaneling and 3D SPI systems, enhancing precision, yield, and speed for advanced packaging solutions.
The Engineer Behind 50 Years of Medtech Innovation
With more than 75 patents, Promex CEO Dick Otte helped shape the medical devices used today. In this Q&A with 24x7 magazine, he shares how engineering decisions have lasting effects on performance, serviceability, and the evolution of medtech. Read the full...
Can Chiplets Serve Cost-Conscious Apps?
Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity,...
Packaging With Fewer People And Better Results
In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in vertically stacked devices, isolate analog or RF functions from digital noise, and align components with...
iMAPS CHIPcon 2025
Promex will be exhibiting at CHIPcon 2025 in Dallas, Texas, from July 7-10, 2025. Make sure to stop by and tell us about your latest microelectronics assembly or packaging project, or contact Rosie Media at rmedina@promex-ind.com to set up a meeting. About CHIPcon...
Benefits And Challenges In Multi-Die Assemblies
In part 3 of this Experts at the Table conversation, Semiconductor Engineering discussed chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex...
Big Changes Ahead For Interposers And Substrates
Interposers and substrates are evolving from passive connectors into advanced platforms that manage power, heat, and high-density interconnects in cutting-edge computing systems. Driven by AI and HPC demands, this shift addresses the widening gap between shrinking...
What Exactly Are Chiplets And Heterogeneous Integration?
The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they’re reading. But speakers sometimes stumble during a presentation trying to figure out whether a...
NextFlex Innovation Days 2025
Promex will have a member exhibit at NextFlex Innovation Days in Santa Clara, CA, from March 25-26, 2025. Make sure to stop by and tell us about your latest microelectronics assembly or packaging project, or contact Rosie Media at rmedina@promex-ind.com to set up a...
Challenges Grow For Medical ICs
Demand for medical ICs used inside and outside the body is growing rapidly, but unique manufacturing and functional requirements coupled with low volumes have turned this into a complex and extremely challenging market. In this Semiconductor Engineering article,...
Linear Pluggable Optics Save Energy In Data Centers
Linear pluggable optics (LPO) is garnering more attention as a way to quickly and efficiently move data in and out of server racks, but a lack of standards for connecting the optical modules is slowing adoption at a time when there is growing pressure to reduce...
Promex Expands Assembly Line with UV Laser & SPI Systems
Promex boosts microelectronics assembly with UV laser depaneling and 3D SPI systems, enhancing precision, yield, and speed for advanced packaging solutions.
The Engineer Behind 50 Years of Medtech Innovation
With more than 75 patents, Promex CEO Dick Otte helped shape the medical devices used today. In this Q&A with 24x7 magazine, he shares how engineering decisions have lasting effects on performance, serviceability, and the evolution of medtech. Read the full...
Can Chiplets Serve Cost-Conscious Apps?
Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity,...
Packaging With Fewer People And Better Results
In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in vertically stacked devices, isolate analog or RF functions from digital noise, and align components with...
iMAPS CHIPcon 2025
Promex will be exhibiting at CHIPcon 2025 in Dallas, Texas, from July 7-10, 2025. Make sure to stop by and tell us about your latest microelectronics assembly or packaging project, or contact Rosie Media at rmedina@promex-ind.com to set up a meeting. About CHIPcon...
Benefits And Challenges In Multi-Die Assemblies
In part 3 of this Experts at the Table conversation, Semiconductor Engineering discussed chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex...
Big Changes Ahead For Interposers And Substrates
Interposers and substrates are evolving from passive connectors into advanced platforms that manage power, heat, and high-density interconnects in cutting-edge computing systems. Driven by AI and HPC demands, this shift addresses the widening gap between shrinking...
What Exactly Are Chiplets And Heterogeneous Integration?
The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they’re reading. But speakers sometimes stumble during a presentation trying to figure out whether a...
NextFlex Innovation Days 2025
Promex will have a member exhibit at NextFlex Innovation Days in Santa Clara, CA, from March 25-26, 2025. Make sure to stop by and tell us about your latest microelectronics assembly or packaging project, or contact Rosie Media at rmedina@promex-ind.com to set up a...
Challenges Grow For Medical ICs
Demand for medical ICs used inside and outside the body is growing rapidly, but unique manufacturing and functional requirements coupled with low volumes have turned this into a complex and extremely challenging market. In this Semiconductor Engineering article,...
Linear Pluggable Optics Save Energy In Data Centers
Linear pluggable optics (LPO) is garnering more attention as a way to quickly and efficiently move data in and out of server racks, but a lack of standards for connecting the optical modules is slowing adoption at a time when there is growing pressure to reduce...