Promex Newsroom
Promex Newsroom
Keep up with the latest company news, industry media, and press releases from Promex – a leader in sophisticated miniaturization technology.
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Key Considerations in Designing, Developing, and Manufacturing Implantable Devices
Designing and developing implantable medical devices involves navigating complex technical challenges while ensuring the highest standards of patient safety and device performance. For companies like Injectsense, creating an implantable device that can function...
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Key Considerations in Designing, Developing, and Manufacturing Implantable Devices
Designing and developing implantable medical devices involves navigating complex technical challenges while ensuring the highest standards of patient safety and device performance. For companies like Injectsense, creating an implantable device that can function...
Cooling Chips Still A Top Challenge
Increasing levels of semiconductor integration means more work needs to be done in smaller spaces, which in turn generates more heat that needs to be dissipated. Managing heat dissipation in advanced node dies and in multi-die assemblies is critical to their...
Promex Industries CEO Richard Otte Honored with IEEE Electronics Manufacturing Technology Award
Award Recognizing Numerous Contributions to Be Presented at ECTC 2025 SANTA CLARA, Calif. – May 20, 2025 – Promex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced that CEO...
Promex and Realeve Recognized by MedTech Breakthrough for Best New Pain Management Solution
Realeve partnered with Promex for the development and manufacturing of its Pulsante™ Micro-Neurostimulator System SANTA CLARA, Calif. (May 8, 2025) — Promex, the leader in microelectronic component assembly, process design, and packaging of medtech and biotech...
Promex Expands Assembly Line with UV Laser & SPI Systems
Promex boosts microelectronics assembly with UV laser depaneling and 3D SPI systems, enhancing precision, yield, and speed for advanced packaging solutions.
The Engineer Behind 50 Years of Medtech Innovation
With more than 75 patents, Promex CEO Dick Otte helped shape the medical devices used today. In this Q&A with 24x7 magazine, he shares how engineering decisions have lasting effects on performance, serviceability, and the evolution of medtech. Read the full...
Can Chiplets Serve Cost-Conscious Apps?
Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity,...
Packaging With Fewer People And Better Results
In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in vertically stacked devices, isolate analog or RF functions from digital noise, and align components with...
iMAPS CHIPcon 2025
Promex will be exhibiting at CHIPcon 2025 in Dallas, Texas, from July 7-10, 2025. Make sure to stop by and tell us about your latest microelectronics assembly or packaging project, or contact Rosie Media at rmedina@promex-ind.com to set up a meeting. About CHIPcon...
Benefits And Challenges In Multi-Die Assemblies
In part 3 of this Experts at the Table conversation, Semiconductor Engineering discussed chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex...
Big Changes Ahead For Interposers And Substrates
Interposers and substrates are evolving from passive connectors into advanced platforms that manage power, heat, and high-density interconnects in cutting-edge computing systems. Driven by AI and HPC demands, this shift addresses the widening gap between shrinking...
Key Considerations in Designing, Developing, and Manufacturing Implantable Devices
Designing and developing implantable medical devices involves navigating complex technical challenges while ensuring the highest standards of patient safety and device performance. For companies like Injectsense, creating an implantable device that can function...
Cooling Chips Still A Top Challenge
Increasing levels of semiconductor integration means more work needs to be done in smaller spaces, which in turn generates more heat that needs to be dissipated. Managing heat dissipation in advanced node dies and in multi-die assemblies is critical to their...
Promex Industries CEO Richard Otte Honored with IEEE Electronics Manufacturing Technology Award
Award Recognizing Numerous Contributions to Be Presented at ECTC 2025 SANTA CLARA, Calif. – May 20, 2025 – Promex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced that CEO...
Promex and Realeve Recognized by MedTech Breakthrough for Best New Pain Management Solution
Realeve partnered with Promex for the development and manufacturing of its Pulsante™ Micro-Neurostimulator System SANTA CLARA, Calif. (May 8, 2025) — Promex, the leader in microelectronic component assembly, process design, and packaging of medtech and biotech...
Promex Expands Assembly Line with UV Laser & SPI Systems
Promex boosts microelectronics assembly with UV laser depaneling and 3D SPI systems, enhancing precision, yield, and speed for advanced packaging solutions.
The Engineer Behind 50 Years of Medtech Innovation
With more than 75 patents, Promex CEO Dick Otte helped shape the medical devices used today. In this Q&A with 24x7 magazine, he shares how engineering decisions have lasting effects on performance, serviceability, and the evolution of medtech. Read the full...
Can Chiplets Serve Cost-Conscious Apps?
Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity,...
Packaging With Fewer People And Better Results
In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in vertically stacked devices, isolate analog or RF functions from digital noise, and align components with...
iMAPS CHIPcon 2025
Promex will be exhibiting at CHIPcon 2025 in Dallas, Texas, from July 7-10, 2025. Make sure to stop by and tell us about your latest microelectronics assembly or packaging project, or contact Rosie Media at rmedina@promex-ind.com to set up a meeting. About CHIPcon...
Benefits And Challenges In Multi-Die Assemblies
In part 3 of this Experts at the Table conversation, Semiconductor Engineering discussed chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex...
Big Changes Ahead For Interposers And Substrates
Interposers and substrates are evolving from passive connectors into advanced platforms that manage power, heat, and high-density interconnects in cutting-edge computing systems. Driven by AI and HPC demands, this shift addresses the widening gap between shrinking...