Designing and developing implantable medical devices involves navigating complex technical challenges while ensuring the highest standards of patient safety and device performance. For companies like Injectsense, creating an implantable device that can function...

Increasing levels of semiconductor integration means more work needs to be done in smaller spaces, which in turn generates more heat that needs to be dissipated. Managing heat dissipation in advanced node dies and in multi-die assemblies is critical to their...

With more than 75 patents, Promex CEO Dick Otte helped shape the medical devices used today. In this Q&A with 24x7 magazine, he shares how engineering decisions have lasting effects on performance, serviceability, and the evolution of medtech. Read the full...

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity,...

In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in vertically stacked devices, isolate analog or RF functions from digital noise, and align components with...

In part 3 of this Experts at the Table conversation, Semiconductor Engineering discussed chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex...

Interposers and substrates are evolving from passive connectors into advanced platforms that manage power, heat, and high-density interconnects in cutting-edge computing systems. Driven by AI and HPC demands, this shift addresses the widening gap between shrinking...

Designing and developing implantable medical devices involves navigating complex technical challenges while ensuring the highest standards of patient safety and device performance. For companies like Injectsense, creating an implantable device that can function...

Increasing levels of semiconductor integration means more work needs to be done in smaller spaces, which in turn generates more heat that needs to be dissipated. Managing heat dissipation in advanced node dies and in multi-die assemblies is critical to their...

With more than 75 patents, Promex CEO Dick Otte helped shape the medical devices used today. In this Q&A with 24x7 magazine, he shares how engineering decisions have lasting effects on performance, serviceability, and the evolution of medtech. Read the full...

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity,...

In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in vertically stacked devices, isolate analog or RF functions from digital noise, and align components with...

In part 3 of this Experts at the Table conversation, Semiconductor Engineering discussed chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex...

Interposers and substrates are evolving from passive connectors into advanced platforms that manage power, heat, and high-density interconnects in cutting-edge computing systems. Driven by AI and HPC demands, this shift addresses the widening gap between shrinking...