Sep 19, 2024 | Media Coverage
Dick Otte, CEO of Promex Industries and QP Technologies, sat down with Semiecosystem to discuss traditional chip scaling, chiplets, mature package types, and reshoring, as well as the issues in packaging for medical devices and compound semiconductors. Read the full...
Sep 19, 2024 | Media Coverage
Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. In this Semiconductor Engineering article, Dick Otte, CEO of Promex, shares...
Aug 30, 2024 | Media Coverage
Medical devices are getting smaller, smarter, and more powerful – much like the evolution of computers. In fact, many of today’s microelectronic-containing medical devices act very much like minicomputers — sensing, seeing, gathering and sharing data, from both...
Aug 21, 2024 | Media Coverage
The semiconductor industry is converging on 3.5D as the next best option in advanced packaging, a hybrid approach that includes stacking logic chiplets and bonding them separately to a substrate shared by other components. In this Semiconductor Engineering article,...
Aug 15, 2024 | Media Coverage
High-volume products get more than their fair share of attention in the semiconductor world, but most chips don’t fit into that category. While a few huge fabs and offshore assembly and test (OSAT) houses process enormous volumes of chips, small fabs and packaging...
Aug 8, 2024 | Media Coverage
Mechanical tolerance issues can wreak havoc on manufacturing your integrated microelectronic medical device, adding unnecessary costs and delays throughout the product development process and negatively impacting final functional yield. Promex COO and VP of...
