Feb 4, 2025 | Media Coverage
Semiconductor chips, including microelectromechanical systems (MEMS), have revolutionized sensors in recent times. The inclusion in sensors of these miniature semiconductor and mechanical devices enables detection, analysis, communication and physical motion...
Jan 29, 2025 | Media Coverage
Semiconductor Engineering sat down to discuss advances in packaging with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director...
Jan 23, 2025 | Media Coverage
As electronic systems grow increasingly complex and energy-intensive, traditional power management methods — centered on centralized systems and external components — are proving inadequate. More data needs to be processed in less time with more and often smaller...
Jan 3, 2025 | Media Coverage
Each year, Semiconductor Digest turns to industry leaders and analysts to get their viewpoints on what they expect to see in the coming year in terms of critical tech and business trends. Promex COO Dave Fromm provided his insights on the growing demand for complex...
Dec 17, 2024 | Media Coverage
As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it means to achieve precision, forcing companies to rethink everything...
Nov 21, 2024 | Media Coverage
Fan-Out Panel-Level Packaging (FOPLP) for advanced nodes, once hindered by manufacturability and yield challenges, is emerging as a promising solution to meet the industry’s demands for higher integration densities and cost efficiency. However, the technology still...
