Nov 21, 2024 | Media Coverage
Fan-Out Panel-Level Packaging (FOPLP) for advanced nodes, once hindered by manufacturability and yield challenges, is emerging as a promising solution to meet the industry’s demands for higher integration densities and cost efficiency. However, the technology still...
Nov 12, 2024 | Media Coverage
Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is accelerating, making it harder for the entire ecosystem to keep up with those...
Oct 25, 2024 | Media Coverage
In this ‘Wine Down Friday’ interview for Power Electronics News, Promex CEO Dick Otte reflects on his over 60 years of expertise in industrial solutions, sharing insights into his career development, leadership style, business challenges, and how Promex is adapting to...
Oct 25, 2024 | Media Coverage
Establishing a quality management system (QMS) that is both effective and efficient is a challenging but essential part of ensuring quality in your operations. Whether your organization is seeking compliance with standards like ISO 13485 or ISO 9001, or simply looking...
Oct 24, 2024 | Media Coverage
Decoupling capacitors have long been an important aspect of maintaining a clean power source for integrated circuits, but with noise caused by rising clock frequencies, multiple power domains, and various types of advanced packaging, new approaches are needed. In...
Oct 24, 2024 | Media Coverage
The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and extraordinarily complex problems. At the heart of this change is the...
