Jan 3, 2025 | Media Coverage
Each year, Semiconductor Digest turns to industry leaders and analysts to get their viewpoints on what they expect to see in the coming year in terms of critical tech and business trends. Promex COO Dave Fromm provided his insights on the growing demand for complex...
Dec 17, 2024 | Media Coverage
As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it means to achieve precision, forcing companies to rethink everything...
Nov 21, 2024 | Media Coverage
Fan-Out Panel-Level Packaging (FOPLP) for advanced nodes, once hindered by manufacturability and yield challenges, is emerging as a promising solution to meet the industry’s demands for higher integration densities and cost efficiency. However, the technology still...
Nov 12, 2024 | Media Coverage
Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is accelerating, making it harder for the entire ecosystem to keep up with those...
Oct 25, 2024 | Media Coverage
In this ‘Wine Down Friday’ interview for Power Electronics News, Promex CEO Dick Otte reflects on his over 60 years of expertise in industrial solutions, sharing insights into his career development, leadership style, business challenges, and how Promex is adapting to...
Oct 25, 2024 | Media Coverage
Establishing a quality management system (QMS) that is both effective and efficient is a challenging but essential part of ensuring quality in your operations. Whether your organization is seeking compliance with standards like ISO 13485 or ISO 9001, or simply looking...
