Mar 3, 2025 | Media Coverage
Demand for medical ICs used inside and outside the body is growing rapidly, but unique manufacturing and functional requirements coupled with low volumes have turned this into a complex and extremely challenging market. In this Semiconductor Engineering article, Dave...
Feb 24, 2025 | Media Coverage
Linear pluggable optics (LPO) is garnering more attention as a way to quickly and efficiently move data in and out of server racks, but a lack of standards for connecting the optical modules is slowing adoption at a time when there is growing pressure to reduce power...
Feb 19, 2025 | Media Coverage
Semiconductor Engineering sat down with advanced packaging experts to discuss 3D-IC progress and issues, photonics, and tradeoffs with different interposers and bridge technologies; featuring: Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor;...
Feb 4, 2025 | Media Coverage
Semiconductor chips, including microelectromechanical systems (MEMS), have revolutionized sensors in recent times. The inclusion in sensors of these miniature semiconductor and mechanical devices enables detection, analysis, communication and physical motion...
Jan 29, 2025 | Media Coverage
Semiconductor Engineering sat down to discuss advances in packaging with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director...
Jan 23, 2025 | Media Coverage
As electronic systems grow increasingly complex and energy-intensive, traditional power management methods — centered on centralized systems and external components — are proving inadequate. More data needs to be processed in less time with more and often smaller...
