Apr 2, 2025 | Media Coverage
In part 3 of this Experts at the Table conversation, Semiconductor Engineering discussed chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex...
Mar 24, 2025 | Media Coverage
Interposers and substrates are evolving from passive connectors into advanced platforms that manage power, heat, and high-density interconnects in cutting-edge computing systems. Driven by AI and HPC demands, this shift addresses the widening gap between shrinking...
Mar 20, 2025 | Media Coverage
The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they’re reading. But speakers sometimes stumble during a presentation trying to figure out whether a...
Mar 3, 2025 | Media Coverage
Demand for medical ICs used inside and outside the body is growing rapidly, but unique manufacturing and functional requirements coupled with low volumes have turned this into a complex and extremely challenging market. In this Semiconductor Engineering article, Dave...
Feb 24, 2025 | Media Coverage
Linear pluggable optics (LPO) is garnering more attention as a way to quickly and efficiently move data in and out of server racks, but a lack of standards for connecting the optical modules is slowing adoption at a time when there is growing pressure to reduce power...
Feb 19, 2025 | Media Coverage
Semiconductor Engineering sat down with advanced packaging experts to discuss 3D-IC progress and issues, photonics, and tradeoffs with different interposers and bridge technologies; featuring: Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor;...
