Cooling Chips Still A Top Challenge

Increasing levels of semiconductor integration means more work needs to be done in smaller spaces, which in turn generates more heat that needs to be dissipated. Managing heat dissipation in advanced node dies and in multi-die assemblies is critical to their...

The Engineer Behind 50 Years of Medtech Innovation

With more than 75 patents, Promex CEO Dick Otte helped shape the medical devices used today. In this Q&A with 24×7 magazine, he shares how engineering decisions have lasting effects on performance, serviceability, and the evolution of medtech. Read the full...

Can Chiplets Serve Cost-Conscious Apps?

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity,...

Packaging With Fewer People And Better Results

In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in vertically stacked devices, isolate analog or RF functions from digital noise, and align components with...

Benefits And Challenges In Multi-Die Assemblies

In part 3 of this Experts at the Table conversation, Semiconductor Engineering discussed chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex...