May 28, 2025 | Media Coverage
Designing and developing implantable medical devices involves navigating complex technical challenges while ensuring the highest standards of patient safety and device performance. For companies like Injectsense, creating an implantable device that can function...
May 28, 2025 | Media Coverage
Increasing levels of semiconductor integration means more work needs to be done in smaller spaces, which in turn generates more heat that needs to be dissipated. Managing heat dissipation in advanced node dies and in multi-die assemblies is critical to their...
Apr 17, 2025 | Media Coverage
With more than 75 patents, Promex CEO Dick Otte helped shape the medical devices used today. In this Q&A with 24×7 magazine, he shares how engineering decisions have lasting effects on performance, serviceability, and the evolution of medtech. Read the full...
Apr 17, 2025 | Media Coverage
Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity,...
Apr 17, 2025 | Media Coverage
In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in vertically stacked devices, isolate analog or RF functions from digital noise, and align components with...
Apr 2, 2025 | Media Coverage
In part 3 of this Experts at the Table conversation, Semiconductor Engineering discussed chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex...
