Sensor packaging, particularly for microelectromechanical systems (MEMS), is a critical aspect of modern electronics. MEMS developers have demonstrated a variety of innovative microsensors for almost every possible sensing modality including temperature, pressure, inertial forces, chemical species, magnetic fields, radiation, etc. While MEMS sensors are revolutionizing various industries with their precision and miniaturization, they can present unique product development challenges and risks during design, development, and manufacturing. In an article for Medical Design Briefs, Promex process engineer, Alfonso Villafuerte explained several critical decisions to be made that accommodate the intricacies of MEMS packaging and ensure performance of these sensor-driven devices.