Oct 24, 2024 | Media Coverage
Decoupling capacitors have long been an important aspect of maintaining a clean power source for integrated circuits, but with noise caused by rising clock frequencies, multiple power domains, and various types of advanced packaging, new approaches are needed. In...
Oct 24, 2024 | Media Coverage
The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and extraordinarily complex problems. At the heart of this change is the...
Sep 24, 2024 | Media Coverage
As chips are disaggregated into chiplets, more features are being added into these devices that chipmakers were unable to include in the past due to reticle size limits and the high cost of scaling everything to the latest process node. This has opened the door to new...
Sep 19, 2024 | Media Coverage
Dick Otte, CEO of Promex Industries and QP Technologies, sat down with Semiecosystem to discuss traditional chip scaling, chiplets, mature package types, and reshoring, as well as the issues in packaging for medical devices and compound semiconductors. Read the full...
Sep 19, 2024 | Media Coverage
Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. In this Semiconductor Engineering article, Dick Otte, CEO of Promex, shares...
Aug 30, 2024 | Media Coverage
Medical devices are getting smaller, smarter, and more powerful – much like the evolution of computers. In fact, many of today’s microelectronic-containing medical devices act very much like minicomputers — sensing, seeing, gathering and sharing data, from both...
