Mar 15, 2021 | Articles & Papers, Articles, Videos
A short video of how advances in semiconductor assembly and fabrication are re-shaping medical device design. Advances in semiconductor assembly and fabrication are offering medical device designers new options for smaller, more compact, and more sophisticated...
Mar 1, 2021 | Articles, Videos
A short video looking at how blade dicing remains the optimal solution for wafer singulation in most cases. Singulation is the process of dicing a silicon wafer into individual units and is a critical step in assembly and packaging. Dicing technology has continued...
Feb 20, 2021 | Articles, Articles & Papers
Here are some of unique assembly and production challenges we can solve: The smaller the better. We worked with the customer to design an optical Class 3 device that would be inserted into the human body. Requirements included Class 100 assembly and strict...
Feb 15, 2021 | Articles, Articles & Papers, Videos
A short video of how advances in semiconductor assembly and fabrication are re-shaping medical device design: Advances in semiconductor assembly and fabrication are offering medical device designers new options for smaller, more compact, and more sophisticated...
Apr 15, 2020 | Articles, Articles & Papers
by: Annette Teng, CTO, Promex/Quik-Pak As noted in last month’s blog post, the semiconductor industry has turned its efforts toward the ongoing fleshing out of a roadmap focused on advancing heterogeneous integration (HI). HI integrates separately manufactured...
