A short video of how advances in semiconductor assembly and fabrication are re-shaping medical device design. Advances in semiconductor assembly and fabrication are offering medical device designers new options for smaller, more compact, and more sophisticated...
A short video looking at how blade dicing remains the optimal solution for wafer singulation in most cases. Singulation is the process of dicing a silicon wafer into individual units and is a critical step in assembly and packaging. Dicing technology has continued...
Here are some of unique assembly and production challenges we can solve: The smaller the better. We worked with the customer to design an optical Class 3 device that would be inserted into the human body. Requirements included Class 100 assembly and strict...
A short video of how advances in semiconductor assembly and fabrication are re-shaping medical device design: Advances in semiconductor assembly and fabrication are offering medical device designers new options for smaller, more compact, and more sophisticated...
by: Annette Teng, CTO, Promex/Quik-Pak As noted in last month’s blog post, the semiconductor industry has turned its efforts toward the ongoing fleshing out of a roadmap focused on advancing heterogeneous integration (HI). HI integrates separately manufactured...
Join us on November 20, 2024 at 5 PM for a fun evening of Mexican flavor with a Bay Area-influence: Tequila Signature Sangria, Tasty Tacos & Treats, and Tours of our Facility!
