Solve Complex Product Challenges with Innovative Packaging & Assembly
In our latest white paper, you’ll learn…
- How universal problems can be addressed in unique, differentiable ways
- Why diverse target markets demand diverse solutions
- How taking a designer’s approach to identifying and resolving engineering challenges translates to innovative assembly & packaging solutions
- Real-world examples of projects that Promex has collaborated with customers to bring to commercial fruition
Using traditional tools in new or non-traditional ways is the secret to unlocking true breakthroughs in semiconductor and microelectronics development—as the case studies in this white paper illustrate. Say, for example, you’re a biotech developer working on a genomics project with sensitive surface chemistry highly susceptible to temperature exposure. You need a custom wirebonding method to prevent damaging the device while protecting its electrical and chemical integrity.
Or perhaps you’re developing an RF amplifier for satellite communications with tight frequency and gain-response specifications that traditional assembly processes cannot meet. For you, tightly controlled eutectic die attach and ribbon bonding processes ensure a consistent, high-yield process flow optimized for high-reliability environments.
These are just two of many examples in which selecting the right packaging and assembly approach can mean the difference between success and failure for your project.
Tap into our decades of experience in pushing the boundaries of microelectronics manufacturing to solve your seemingly impossible product conundrum.