Promex will be exhibiting at iMAPS Device Packaging Conference 2026 at The Sheraton Grand at Wild Horse Pass in booth #405. Make sure to stop by and tell us all about your latest microelectronics assembly project, or contact Rosie Media at rmedina@promex-ind.com to set up a meeting.
About iMAPS DPC
The 22nd Annual Device Packaging Conference (DPC 2026) will be held in Phoenix, Arizona, on March 2-5, 2026. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals. The 2026 conference will feature 4 keynote presentations, an embedded Global Business Council Plenary Session, an interactive poster session, an evening panel discussion, and more.
Learn more here: https://imaps.org/page/DPC_2026
March 2-5, 2026
The Sheraton Grand at Wild Horse Pass