Promex will be exhibiting at iMAPS Device Packaging Conference 2025 at Sheraton at Wild Horse Pass in booth #307. Make sure to stop by and tell us about your latest microelectronics assembly project or contact Rosie Media at rmedina@promex-ind.com to set up a meeting.
Join us on March 5th, 5:30 – 7:30 p.m. for a poster presentation, titled Heterogeneous Integration Enables New Functionality in Medical and Biotech Devices.
We will also attend the co-located Advanced Packaging for Medical Microelectronics Workshop. Join us on March 7th at 11:00 a.m. for a presentation on The Flexibility of Wearables and Small Form-Factor Devices: The Art and Science of Adding Chips on Components That Flex.
About iMAPS DPC
The 21st Annual Device Packaging Conference (DPC 2025) is an international event organized by the International Microelectronics Assembly and Packaging Society and a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals. The 2025 conference will feature 4 keynote presentations, technical sessions on Heterogeneous: 2D and 3D Integration/Emerging Technologies/Fan-Out, Wafer/Panel Level & Flip Chip Packaging, an embedded Global Business Council Plenary Session, an interactive poster session, an evening panel discussion, and more.
Learn more:
Learn more about iMAPS DPC here: https://imaps.org/page/DPC2025
March 4-6, 2025
Sheraton at Wild Horse Pass
5594 W Wild Horse Pass Blvd, Chandler, AZ 85226